Strong pinning in ternary (Nd-Sm-Gd)Ba2Cu3O y superconductors

Muralidhar Miryala, S. Nariki, M. Jirsa, Y. Wu, Masato Murakami

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

We have studied the flux pinning in melt-textured (Nd0.33Sm 0.33Gd0.33)Ba2Cu3Oy NSG-123 superconductors with various numbers of Gd2BaCuO5 (Gd-211) particles. Transmission electron microscopy (TEM) showed that submicron Gd-211 particles are uniformly distributed in the superconductive matrix. Dark-field TEM observations further showed that a high density of RE rich RE1+xBa2-xCu3Oy (RE-123ss) clusters 3-10 nm in size were distributed in the NSG-123 matrix. A strongly developed fishtail was observed in the magnetization hysteresis loops of all the samples. A critical current density of 100 kA/cm2 (77 K) was achieved at the secondary peak field of 2 T for the H∥c axis in the NSG-123 sample with 10 mol% Gd-211. Large grain NSG-123 pellets with 30 mol% Gd-211 and 20 wt% AgO 2, 30 mm in diameter and 15 mm in height, exhibited a single-cone profile with a peak value of 1.2 T at 77 K. A higher trapped-field value of 1.5 T was recorded at 2 T, reflecting the secondary peak effect.

Original languageEnglish
Pages (from-to)1016-1018
Number of pages3
JournalApplied Physics Letters
Volume80
Issue number6
DOIs
Publication statusPublished - 2002 Feb 11
Externally publishedYes

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transmission electron microscopy
flux pinning
matrices
pellets
critical current
cones
hysteresis
current density
magnetization
profiles

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Strong pinning in ternary (Nd-Sm-Gd)Ba2Cu3O y superconductors. / Miryala, Muralidhar; Nariki, S.; Jirsa, M.; Wu, Y.; Murakami, Masato.

In: Applied Physics Letters, Vol. 80, No. 6, 11.02.2002, p. 1016-1018.

Research output: Contribution to journalArticle

Miryala, Muralidhar ; Nariki, S. ; Jirsa, M. ; Wu, Y. ; Murakami, Masato. / Strong pinning in ternary (Nd-Sm-Gd)Ba2Cu3O y superconductors. In: Applied Physics Letters. 2002 ; Vol. 80, No. 6. pp. 1016-1018.
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