Structural integrity in electronics

W. J. Plumbridge, Yoshiharu Kariya

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver-containing lead-free solders is superior to that of the traditional Sn-37Pb under cycle-controlled conditions but there is no difference when time-dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.

Original languageEnglish
Pages (from-to)723-734
Number of pages12
JournalFatigue and Fracture of Engineering Materials and Structures
Volume27
Issue number8
DOIs
Publication statusPublished - 2004 Aug
Externally publishedYes

Fingerprint

Structural integrity
Electronic equipment
Silver
Fracture mechanics
Nuclear energy
Soldering alloys
Failure modes
Power generation
Gas turbines
Crack propagation
Lead

Keywords

  • Failure modes
  • Lead-free solders
  • Life prediction
  • Solder joints
  • Structural integrity

ASJC Scopus subject areas

  • Mechanical Engineering
  • Materials Science(all)

Cite this

Structural integrity in electronics. / Plumbridge, W. J.; Kariya, Yoshiharu.

In: Fatigue and Fracture of Engineering Materials and Structures, Vol. 27, No. 8, 08.2004, p. 723-734.

Research output: Contribution to journalArticle

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