Abstract
A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.
| Language | English |
|---|---|
| Title of host publication | Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Number of pages | 1 |
| ISBN (Electronic) | 9784904743034 |
| DOIs | |
| State | Published - 2017 Jun 13 |
| Event | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan Duration: 2017 May 16 → 2017 May 18 |
Other
| Other | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
|---|---|
| Country | Japan |
| City | Tokyo |
| Period | 17/5/16 → 17/5/18 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
Cite this
Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. / Watanabe, Kazuki; Yajima, Naoyuki; Kariya, Yoshiharu; Hiroshima, Yoshiyuki; Kikuchi, Shunichi; Matsui, Akiko; Shimizu, Hiroshi.
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7947481.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via
AU - Watanabe,Kazuki
AU - Yajima,Naoyuki
AU - Kariya,Yoshiharu
AU - Hiroshima,Yoshiyuki
AU - Kikuchi,Shunichi
AU - Matsui,Akiko
AU - Shimizu,Hiroshi
PY - 2017/6/13
Y1 - 2017/6/13
N2 - A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.
AB - A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.
UR - http://www.scopus.com/inward/record.url?scp=85022179128&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85022179128&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2017.7947481
DO - 10.23919/LTB-3D.2017.7947481
M3 - Conference contribution
BT - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PB - Institute of Electrical and Electronics Engineers Inc.
ER -