Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

LanguageEnglish
Title of host publicationProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages1
ISBN (Electronic)9784904743034
DOIs
StatePublished - 2017 Jun 13
Event5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
Duration: 2017 May 162017 May 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
CountryJapan
CityTokyo
Period17/5/1617/5/18

Fingerprint

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films
Printed circuit boards

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

Cite this

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A., & Shimizu, H. (2017). Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947481] Institute of Electrical and Electronics Engineers Inc.. DOI: 10.23919/LTB-3D.2017.7947481

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. / Watanabe, Kazuki; Yajima, Naoyuki; Kariya, Yoshiharu; Hiroshima, Yoshiyuki; Kikuchi, Shunichi; Matsui, Akiko; Shimizu, Hiroshi.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7947481.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Watanabe, K, Yajima, N, Kariya, Y, Hiroshima, Y, Kikuchi, S, Matsui, A & Shimizu, H 2017, Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947481, Institute of Electrical and Electronics Engineers Inc., 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. DOI: 10.23919/LTB-3D.2017.7947481
Watanabe K, Yajima N, Kariya Y, Hiroshima Y, Kikuchi S, Matsui A et al. Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc.2017. 7947481. Available from, DOI: 10.23919/LTB-3D.2017.7947481
Watanabe, Kazuki ; Yajima, Naoyuki ; Kariya, Yoshiharu ; Hiroshima, Yoshiyuki ; Kikuchi, Shunichi ; Matsui, Akiko ; Shimizu, Hiroshi. / Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017.
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