Abstract
A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Number of pages | 1 |
| ISBN (Electronic) | 9784904743034 |
| DOIs | |
| Publication status | Published - 2017 Jun 13 |
| Event | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan Duration: 2017 May 16 → 2017 May 18 |
Other
| Other | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
|---|---|
| Country | Japan |
| City | Tokyo |
| Period | 17/5/16 → 17/5/18 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
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Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A., & Shimizu, H. (2017). Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947481] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947481