Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe; Naoyuki Yajima; Yoshiharu Kariya; Yoshiyuki Hiroshima; Shunichi Kikuchi; Akiko Matsui; Hiroshi Shimizu

doi:10.23919/LTB-3D.2017.7947481

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

Original language	English
Title of host publication	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	85
Number of pages	1
ISBN (Electronic)	9784904743034
DOIs	https://doi.org/10.23919/LTB-3D.2017.7947481
Publication status	Published - 2017 Jun 13
Event	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan Duration: 2017 May 16 → 2017 May 18

Publication series

Name	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Country/Territory	Japan
City	Tokyo
Period	17/5/16 → 17/5/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films

Access to Document

10.23919/LTB-3D.2017.7947481

Cite this

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A., & Shimizu, H. (2017). Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 85). [7947481] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947481

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. / Watanabe, Kazuki; Yajima, Naoyuki; Kariya, Yoshiharu; Hiroshima, Yoshiyuki; Kikuchi, Shunichi; Matsui, Akiko; Shimizu, Hiroshi.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 85 7947481 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Watanabe, K, Yajima, N, Kariya, Y, Hiroshima, Y, Kikuchi, S, Matsui, A & Shimizu, H 2017, Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947481, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., pp. 85, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947481

Watanabe K, Yajima N, Kariya Y, Hiroshima Y, Kikuchi S, Matsui A et al. Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 85. 7947481. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). https://doi.org/10.23919/LTB-3D.2017.7947481

Watanabe, Kazuki ; Yajima, Naoyuki ; Kariya, Yoshiharu ; Hiroshima, Yoshiyuki ; Kikuchi, Shunichi ; Matsui, Akiko ; Shimizu, Hiroshi. / Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 85 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

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title = "Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via",

abstract = "A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.",

author = "Kazuki Watanabe and Naoyuki Yajima and Yoshiharu Kariya and Yoshiyuki Hiroshima and Shunichi Kikuchi and Akiko Matsui and Hiroshi Shimizu",

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AB - A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

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Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

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