| Original language | English |
|---|---|
| Pages (from-to) | .L553-L555 |
| Journal | Japanese Journal of Applied Physics Letters |
| Volume | 33 Part 2 |
| Publication status | Published - 1994 Apr 1 |
Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology
Makoto Hirano
Research output: Contribution to journal › Article › peer-review