Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology

Makoto Hirano

    Research output: Contribution to journalArticle

    Original languageEnglish
    Pages (from-to).L553-L555
    JournalJapanese Journal of Applied Physics Letters
    Volume33 Part 2
    Publication statusPublished - 1994 Apr 1

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