Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology

Makoto Hirano

    Research output: Contribution to journalArticle

    Original languageEnglish
    Pages (from-to).L553-L555
    JournalJapanese Journal of Applied Physics Letters
    Volume33 Part 2
    Publication statusPublished - 1994 Apr 1

    Cite this

    Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology. / Hirano, Makoto.

    In: Japanese Journal of Applied Physics Letters, Vol. 33 Part 2, 01.04.1994, p. .L553-L555.

    Research output: Contribution to journalArticle

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    title = "Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology",
    author = "Makoto Hirano",
    year = "1994",
    month = "4",
    day = "1",
    language = "English",
    volume = "33 Part 2",
    pages = ".L553--L555",
    journal = "Japanese Journal of Applied Physics Letters",

    }

    TY - JOUR

    T1 - Submicronmeter Gold Interconnect Wiring by Sidewall Electroplating Technology

    AU - Hirano, Makoto

    PY - 1994/4/1

    Y1 - 1994/4/1

    M3 - Article

    VL - 33 Part 2

    SP - .L553-L555

    JO - Japanese Journal of Applied Physics Letters

    JF - Japanese Journal of Applied Physics Letters

    ER -