Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

Y. Kakuhara, S. Yokogawa, M. Hiroi, T. Takewaki, K. Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)096504-1-096504-5
JournalJapanese Journal of Applied Physics
Volume48
Publication statusPublished - 2009 Sep 24

Cite this

Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal. / Kakuhara, Y.; Yokogawa, S.; Hiroi, M.; Takewaki, T.; Ueno, K.

In: Japanese Journal of Applied Physics, Vol. 48, 24.09.2009, p. 096504-1-096504-5.

Research output: Contribution to journalArticle

Kakuhara, Y. ; Yokogawa, S. ; Hiroi, M. ; Takewaki, T. ; Ueno, K. / Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal. In: Japanese Journal of Applied Physics. 2009 ; Vol. 48. pp. 096504-1-096504-5.
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