Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

Y. Kakuhara, S. Yokogawa, M. Hiroi, T. Takewaki, K. Ueno

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)096504-1-096504-5
JournalJapanese Journal of Applied Physics
Volume48
Publication statusPublished - 2009 Sep 24

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