Original language | English |
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Pages (from-to) | 096504-1-096504-5 |
Journal | Japanese Journal of Applied Physics |
Volume | 48 |
Publication status | Published - 2009 Sep 24 |
Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal
Y. Kakuhara, S. Yokogawa, M. Hiroi, T. Takewaki, K. Ueno
Research output: Contribution to journal › Article › peer-review