| Original language | English |
|---|---|
| Pages (from-to) | 096504-1-096504-5 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 48 |
| Publication status | Published - 2009 Sep 24 |
Cite this
Kakuhara, Y., Yokogawa, S., Hiroi, M., Takewaki, T., & Ueno, K. (2009). Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal. Japanese Journal of Applied Physics, 48, 096504-1-096504-5.
Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal. / Kakuhara, Y.; Yokogawa, S.; Hiroi, M.; Takewaki, T.; Ueno, K.
In: Japanese Journal of Applied Physics, Vol. 48, 24.09.2009, p. 096504-1-096504-5.Research output: Contribution to journal › Article
Kakuhara, Y, Yokogawa, S, Hiroi, M, Takewaki, T & Ueno, K 2009, 'Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal', Japanese Journal of Applied Physics, vol. 48, pp. 096504-1-096504-5.
Kakuhara Y, Yokogawa S, Hiroi M, Takewaki T, Ueno K. Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal. Japanese Journal of Applied Physics. 2009 Sep 24;48:096504-1-096504-5.
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title = "Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal",
author = "Y. Kakuhara and S. Yokogawa and M. Hiroi and T. Takewaki and K. Ueno",
year = "2009",
month = "9",
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T1 - Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal
AU - Kakuhara, Y.
AU - Yokogawa, S.
AU - Hiroi, M.
AU - Takewaki, T.
AU - Ueno, K.
PY - 2009/9/24
Y1 - 2009/9/24
M3 - Article
VL - 48
SP - 096504-1-096504-5
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
ER -