Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

Y. Kakuhara, S. Yokogawa, M. Hiroi, T. Takewaki, K. Ueno

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	096504-1-096504-5
Journal	Japanese Journal of Applied Physics
Volume	48
Publication status	Published - 2009 Sep 24

Cite this

@article{7818a0f8baf34287a46ec5dd21a25fa9,

title = "Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal",

author = "Y. Kakuhara and S. Yokogawa and M. Hiroi and T. Takewaki and K. Ueno",

year = "2009",

month = sep,

day = "24",

language = "English",

volume = "48",

pages = "096504--1--096504--5",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

}

TY - JOUR

T1 - Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

AU - Kakuhara, Y.

AU - Yokogawa, S.

AU - Hiroi, M.

AU - Takewaki, T.

AU - Ueno, K.

PY - 2009/9/24

Y1 - 2009/9/24

M3 - Article

VL - 48

SP - 096504-1-096504-5

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

ER -