Surface amorphization in Zr alloy films via Ni implantation

Shinji Muraishi, Hirono Naito, Tatuhiko Aizawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ∼100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at%Ni for Zr, 6at%Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.

Original languageEnglish
Title of host publicationTMS Annual Meeting
Pages23-27
Number of pages5
Volume2006
Publication statusPublished - 2006
Externally publishedYes
Event135th TMS Annual Meeting, 2006 - San Antonio, TX
Duration: 2006 Mar 122006 Mar 16

Other

Other135th TMS Annual Meeting, 2006
CitySan Antonio, TX
Period06/3/1206/3/16

Fingerprint

Amorphization
X-ray spectroscopy
transmission electron microscopy
X ray photoelectron spectroscopy
Crystalline materials
Transmission electron microscopy
substrate
Substrates

Keywords

  • Ion implantation
  • Metallic glass
  • Solid-state amorphization
  • Zr-Cu film

ASJC Scopus subject areas

  • Geology
  • Metals and Alloys

Cite this

Muraishi, S., Naito, H., & Aizawa, T. (2006). Surface amorphization in Zr alloy films via Ni implantation. In TMS Annual Meeting (Vol. 2006, pp. 23-27)

Surface amorphization in Zr alloy films via Ni implantation. / Muraishi, Shinji; Naito, Hirono; Aizawa, Tatuhiko.

TMS Annual Meeting. Vol. 2006 2006. p. 23-27.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Muraishi, S, Naito, H & Aizawa, T 2006, Surface amorphization in Zr alloy films via Ni implantation. in TMS Annual Meeting. vol. 2006, pp. 23-27, 135th TMS Annual Meeting, 2006, San Antonio, TX, 06/3/12.
Muraishi S, Naito H, Aizawa T. Surface amorphization in Zr alloy films via Ni implantation. In TMS Annual Meeting. Vol. 2006. 2006. p. 23-27
Muraishi, Shinji ; Naito, Hirono ; Aizawa, Tatuhiko. / Surface amorphization in Zr alloy films via Ni implantation. TMS Annual Meeting. Vol. 2006 2006. pp. 23-27
@inproceedings{b45c6528b32c4a02a60242ca16c7aa13,
title = "Surface amorphization in Zr alloy films via Ni implantation",
abstract = "Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ∼100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at{\%}Ni for Zr, 6at{\%}Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.",
keywords = "Ion implantation, Metallic glass, Solid-state amorphization, Zr-Cu film",
author = "Shinji Muraishi and Hirono Naito and Tatuhiko Aizawa",
year = "2006",
language = "English",
isbn = "087339626X",
volume = "2006",
pages = "23--27",
booktitle = "TMS Annual Meeting",

}

TY - GEN

T1 - Surface amorphization in Zr alloy films via Ni implantation

AU - Muraishi, Shinji

AU - Naito, Hirono

AU - Aizawa, Tatuhiko

PY - 2006

Y1 - 2006

N2 - Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ∼100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at%Ni for Zr, 6at%Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.

AB - Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ∼100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at%Ni for Zr, 6at%Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.

KW - Ion implantation

KW - Metallic glass

KW - Solid-state amorphization

KW - Zr-Cu film

UR - http://www.scopus.com/inward/record.url?scp=33845936363&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33845936363&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:33845936363

SN - 087339626X

SN - 9780873396264

VL - 2006

SP - 23

EP - 27

BT - TMS Annual Meeting

ER -