Synthetic criterion for level-1 crack-free package - proposal of a superior package structure

Yumi Inoue, Kanako Sawada, Noriyasu Kawamura, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)

Abstract

A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages71-77
Number of pages7
Publication statusPublished - 1996
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: 1996 May 281996 May 31

Other

OtherProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
CityOrlando, FL, USA
Period96/5/2896/5/31

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Inoue, Y., Sawada, K., Kawamura, N., & Sudo, T. (1996). Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. In Proceedings - Electronic Components and Technology Conference (pp. 71-77). IEEE.