Synthetic criterion for level-1 crack-free package - proposal of a superior package structure

Yumi Inoue, Kanako Sawada, Noriyasu Kawamura, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)

Abstract

A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages71-77
Number of pages7
Publication statusPublished - 1996
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: 1996 May 281996 May 31

Other

OtherProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
CityOrlando, FL, USA
Period96/5/2896/5/31

Fingerprint

Cracks
Delamination
Moisture

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Inoue, Y., Sawada, K., Kawamura, N., & Sudo, T. (1996). Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. In Proceedings - Electronic Components and Technology Conference (pp. 71-77). IEEE.

Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. / Inoue, Yumi; Sawada, Kanako; Kawamura, Noriyasu; Sudo, Toshio.

Proceedings - Electronic Components and Technology Conference. IEEE, 1996. p. 71-77.

Research output: Chapter in Book/Report/Conference proceedingChapter

Inoue, Y, Sawada, K, Kawamura, N & Sudo, T 1996, Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 71-77, Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC, Orlando, FL, USA, 96/5/28.
Inoue Y, Sawada K, Kawamura N, Sudo T. Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. In Proceedings - Electronic Components and Technology Conference. IEEE. 1996. p. 71-77
Inoue, Yumi ; Sawada, Kanako ; Kawamura, Noriyasu ; Sudo, Toshio. / Synthetic criterion for level-1 crack-free package - proposal of a superior package structure. Proceedings - Electronic Components and Technology Conference. IEEE, 1996. pp. 71-77
@inbook{8aad88584d494fe5bdf6f9e3a757e986,
title = "Synthetic criterion for level-1 crack-free package - proposal of a superior package structure",
abstract = "A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.",
author = "Yumi Inoue and Kanako Sawada and Noriyasu Kawamura and Toshio Sudo",
year = "1996",
language = "English",
pages = "71--77",
booktitle = "Proceedings - Electronic Components and Technology Conference",
publisher = "IEEE",

}

TY - CHAP

T1 - Synthetic criterion for level-1 crack-free package - proposal of a superior package structure

AU - Inoue, Yumi

AU - Sawada, Kanako

AU - Kawamura, Noriyasu

AU - Sudo, Toshio

PY - 1996

Y1 - 1996

N2 - A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.

AB - A synthetic criterion to provide guidance for the high-reliability structure design for the level-1 crack-free package is introduced. The criterion reflects a consideration of both delamination and package cracking. According to the criterion, to prevent delamination is the most effective means to realize the level-1 crack-free package for large chips (ex. 15mm square). Therefore, a new package structure, a chip side support (CSS) structure which eliminates a die-pad is proposed and reliability tests are carried out. The CSS package realizes the level-1 crack-free package without moisture-proof packing.

UR - http://www.scopus.com/inward/record.url?scp=0029721490&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029721490&partnerID=8YFLogxK

M3 - Chapter

AN - SCOPUS:0029721490

SP - 71

EP - 77

BT - Proceedings - Electronic Components and Technology Conference

PB - IEEE

ER -