The deposition rates for Cu-CVD with Cu(hfac)(tmvs)

A.Kobayashi A.Kobayashi, A.Sekiguchi A.Sekiguchi, K.Ikeda K.Ikeda, O.Okada O.Okada, N.Hosokasa N.Hosokasa, Y.Tsuchoya Y.Tsuchoya, K.Ueno K.Ueno, Kazuyoshi Ueno

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)177-183
JournalProceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996
Publication statusPublished - 1997 Apr 1

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