Original language | English |
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Pages (from-to) | 177-183 |
Journal | Proceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996 |
Publication status | Published - 1997 Apr 1 |
The deposition rates for Cu-CVD with Cu(hfac)(tmvs)
A.Kobayashi A.Kobayashi, A.Sekiguchi A.Sekiguchi, K.Ikeda K.Ikeda, O.Okada O.Okada, N.Hosokasa N.Hosokasa, Y.Tsuchoya Y.Tsuchoya, K.Ueno K.Ueno, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review