The deposition rates for Cu-CVD with Cu(hfac)(tmvs)

A.Kobayashi A.Kobayashi, A.Sekiguchi A.Sekiguchi, K.Ikeda K.Ikeda, O.Okada O.Okada, N.Hosokasa N.Hosokasa, Y.Tsuchoya Y.Tsuchoya, K.Ueno K.Ueno, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)177-183
JournalProceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996
Publication statusPublished - 1997 Apr 1

Cite this

A.Kobayashi, A. K., A.Sekiguchi, A. S., K.Ikeda, K. I., O.Okada, O. O., N.Hosokasa, N. H., Y.Tsuchoya, Y. T., K.Ueno, K. U., & Ueno, K. (1997). The deposition rates for Cu-CVD with Cu(hfac)(tmvs). Proceedings of Advanced Metallization and Interconnect Systems for ULSI Applications in 1996, 177-183.