The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda, Noboru Hidaka, Mitsuo Yamashita, Kenichi Sakaue, Takeshi Ogawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages725-730
Number of pages6
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: 2009 Dec 92009 Dec 11

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2009 11th Electronic Packaging Technology Conference, EPTC 2009
CountrySingapore
CitySingapore
Period09/12/909/12/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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    Shimoda, M., Hidaka, N., Yamashita, M., Sakaue, K., & Ogawa, T. (2009). The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference (pp. 725-730). [5416454] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2009.5416454