The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda; Noboru Hidaka; Mitsuo Yamashita; Kenichi Sakaue; Takeshi Ogawa

doi:10.1109/EPTC.2009.5416454

The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda, Noboru Hidaka, Mitsuo Yamashita, Kenichi Sakaue, Takeshi Ogawa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

Original language	English
Title of host publication	EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages	725-730
Number of pages	6
DOIs	https://doi.org/10.1109/EPTC.2009.5416454
Publication status	Published - 2009 Dec 1
Externally published	Yes
Event	2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore Duration: 2009 Dec 9 → 2009 Dec 11

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference	2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/Territory	Singapore
City	Singapore
Period	09/12/9 → 09/12/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

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10.1109/EPTC.2009.5416454

Cite this

Shimoda, M., Hidaka, N., Yamashita, M., Sakaue, K., & Ogawa, T. (2009). The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. In EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference (pp. 725-730). [5416454] (Proceedings of the Electronic Packaging Technology Conference, EPTC). https://doi.org/10.1109/EPTC.2009.5416454

The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. / Shimoda, Masayoshi; Hidaka, Noboru; Yamashita, Mitsuo et al.

EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 2009. p. 725-730 5416454 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shimoda, M, Hidaka, N, Yamashita, M, Sakaue, K & Ogawa, T 2009, The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. in EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference., 5416454, Proceedings of the Electronic Packaging Technology Conference, EPTC, pp. 725-730, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, Singapore, 09/12/9. https://doi.org/10.1109/EPTC.2009.5416454

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abstract = "Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.",

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AU - Ogawa, Takeshi

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AB - Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

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The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

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