The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda, Noboru Hidaka, Mitsuo Yamashita, Kenichi Sakaue, Takeshi Ogawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

Original languageEnglish
Title of host publicationProceedings of the Electronic Packaging Technology Conference, EPTC
Pages725-730
Number of pages6
DOIs
Publication statusPublished - 2009
Externally publishedYes
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore
Duration: 2009 Dec 92009 Dec 11

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CitySingapore
Period09/12/909/12/11

Fingerprint

solders
Soldering alloys
mechanical properties
Mechanical properties
microstructure
Microstructure
Soldering
Indentation
Strength of materials
Creep
soldering
elastic deformation
Plastics
indentation
plastic deformation
Testing
costs
Costs
Lead-free solders

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Shimoda, M., Hidaka, N., Yamashita, M., Sakaue, K., & Ogawa, T. (2009). The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. In Proceedings of the Electronic Packaging Technology Conference, EPTC (pp. 725-730). [5416454] https://doi.org/10.1109/EPTC.2009.5416454

The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. / Shimoda, Masayoshi; Hidaka, Noboru; Yamashita, Mitsuo; Sakaue, Kenichi; Ogawa, Takeshi.

Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 725-730 5416454.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shimoda, M, Hidaka, N, Yamashita, M, Sakaue, K & Ogawa, T 2009, The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. in Proceedings of the Electronic Packaging Technology Conference, EPTC., 5416454, pp. 725-730, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 09/12/9. https://doi.org/10.1109/EPTC.2009.5416454
Shimoda M, Hidaka N, Yamashita M, Sakaue K, Ogawa T. The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. In Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. p. 725-730. 5416454 https://doi.org/10.1109/EPTC.2009.5416454
Shimoda, Masayoshi ; Hidaka, Noboru ; Yamashita, Mitsuo ; Sakaue, Kenichi ; Ogawa, Takeshi. / The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders. Proceedings of the Electronic Packaging Technology Conference, EPTC. 2009. pp. 725-730
@inproceedings{55de50e73dbb4d0db1424880241642b8,
title = "The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders",
abstract = "Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt{\%} and 1.0wt{\%} Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.",
author = "Masayoshi Shimoda and Noboru Hidaka and Mitsuo Yamashita and Kenichi Sakaue and Takeshi Ogawa",
year = "2009",
doi = "10.1109/EPTC.2009.5416454",
language = "English",
isbn = "9781424451005",
pages = "725--730",
booktitle = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

}

TY - GEN

T1 - The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

AU - Shimoda, Masayoshi

AU - Hidaka, Noboru

AU - Yamashita, Mitsuo

AU - Sakaue, Kenichi

AU - Ogawa, Takeshi

PY - 2009

Y1 - 2009

N2 - Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

AB - Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

UR - http://www.scopus.com/inward/record.url?scp=77950962747&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950962747&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2009.5416454

DO - 10.1109/EPTC.2009.5416454

M3 - Conference contribution

SN - 9781424451005

SP - 725

EP - 730

BT - Proceedings of the Electronic Packaging Technology Conference, EPTC

ER -