The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

E.Hosomi E.Hosomi, C.Takubo C.Takubo, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, F.Takahashi F.Takahashi, K.Saito K.Saito, N.Nakajima N.Nakajima, M.Nakazono M.Nakazono, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)128-133
Journal8th IMC
Publication statusPublished - 1994 May 25

Cite this

E.Hosomi, E. H., C.Takubo, C. T., Y.Hiruta, Y. H., T.Sudo, T. S., F.Takahashi, F. T., K.Saito, K. S., N.Nakajima, N. N., M.Nakazono, M. N., & Sudo, T. (1994). The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging, 8th IMC, 128-133.