Thermal Characterization of Resin Die-bond Defects for VLSI Packages

Y.Yamaji Y.Yamaji, Y.Tsuboi Y.Tsuboi, O.Yamagata O.Yamagata, H.Nakayoshi H.Nakayoshi, M.Nii M.Nii, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)123-126
JournalThe 2nd VLSI Packaging Workshop of Japan,
Publication statusPublished - 1994 Dec 5

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Y.Yamaji, Y. Y., Y.Tsuboi, Y. T., O.Yamagata, O. Y., H.Nakayoshi, H. N., M.Nii, M. N., T.Sudo, T. S., & Sudo, T. (1994). Thermal Characterization of Resin Die-bond Defects for VLSI Packages. The 2nd VLSI Packaging Workshop of Japan, 123-126.