Thermal Characterization of Resin Die-bond Defects for VLSI Packages

Y.Yamaji Y.Yamaji, Y.Tsuboi Y.Tsuboi, O.Yamagata O.Yamagata, H.Nakayoshi H.Nakayoshi, M.Nii M.Nii, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)123-126
JournalThe 2nd VLSI Packaging Workshop of Japan,
Publication statusPublished - 1994 Dec 5

Cite this

Y.Yamaji, Y. Y., Y.Tsuboi, Y. T., O.Yamagata, O. Y., H.Nakayoshi, H. N., M.Nii, M. N., T.Sudo, T. S., & Sudo, T. (1994). Thermal Characterization of Resin Die-bond Defects for VLSI Packages. The 2nd VLSI Packaging Workshop of Japan, 123-126.

Thermal Characterization of Resin Die-bond Defects for VLSI Packages. / Y.Yamaji, Y.Yamaji; Y.Tsuboi, Y.Tsuboi; O.Yamagata, O.Yamagata; H.Nakayoshi, H.Nakayoshi; M.Nii, M.Nii; T.Sudo, T.Sudo; Sudo, Toshio.

In: The 2nd VLSI Packaging Workshop of Japan, 05.12.1994, p. 123-126.

Research output: Contribution to journalArticle

Y.Yamaji, YY, Y.Tsuboi, YT, O.Yamagata, OY, H.Nakayoshi, HN, M.Nii, MN, T.Sudo, TS & Sudo, T 1994, 'Thermal Characterization of Resin Die-bond Defects for VLSI Packages', The 2nd VLSI Packaging Workshop of Japan, pp. 123-126.
Y.Yamaji YY, Y.Tsuboi YT, O.Yamagata OY, H.Nakayoshi HN, M.Nii MN, T.Sudo TS et al. Thermal Characterization of Resin Die-bond Defects for VLSI Packages. The 2nd VLSI Packaging Workshop of Japan,. 1994 Dec 5;123-126.
Y.Yamaji, Y.Yamaji ; Y.Tsuboi, Y.Tsuboi ; O.Yamagata, O.Yamagata ; H.Nakayoshi, H.Nakayoshi ; M.Nii, M.Nii ; T.Sudo, T.Sudo ; Sudo, Toshio. / Thermal Characterization of Resin Die-bond Defects for VLSI Packages. In: The 2nd VLSI Packaging Workshop of Japan,. 1994 ; pp. 123-126.
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