Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

K. Warashina, Yoshiharu Kariya, Y. Hirata, M. Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Quad flat pack (QFP) leads/Sn-3.5Ag-X (X=Bi and Cu) joint was thermally cycled between 243 K and 403 K or 273 K and 373 K, and relationship between thermal fatigue of QFP solder joint and isothermal fatigue properties of bulk solder has been discussed. Both metallographic examination and mechanical pull test were preformed to evaluate thermal fatigue damage of the joint. The addition of bismuth drastically degrades the thermal fatigue resistance of Sn-3.5Ag solder. On the other hand the pull strength of Sn-3.5Ag-Cu solder joints slightly decreased with increasing number of thermal cycles, though it still remains higher in comparison to that for conventional Sn-37Pb or bismuth containing solder joints. The behavior observed here reflects the isothermal fatigue properties of bulk solder because thermal fatigue crack initiates at the surface of the solder fillet and propagates within the fillet in an early stage of fatigue damage.

Original languageEnglish
Title of host publicationProceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages626-631
Number of pages6
ISBN (Electronic)0769500072, 9780769500072
DOIs
Publication statusPublished - 1999 Jan 1
Event1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999 - Tokyo, Japan
Duration: 1999 Feb 11999 Feb 3

Other

Other1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
CountryJapan
CityTokyo
Period99/2/199/2/3

Fingerprint

Thermal fatigue
Fatigue damage
Soldering alloys
Fatigue of materials
Bismuth
Lead

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

Cite this

Warashina, K., Kariya, Y., Hirata, Y., & Otsuka, M. (1999). Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. In Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999 (pp. 626-631). [747688] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECODIM.1999.747688

Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. / Warashina, K.; Kariya, Yoshiharu; Hirata, Y.; Otsuka, M.

Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Institute of Electrical and Electronics Engineers Inc., 1999. p. 626-631 747688.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Warashina, K, Kariya, Y, Hirata, Y & Otsuka, M 1999, Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. in Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999., 747688, Institute of Electrical and Electronics Engineers Inc., pp. 626-631, 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999, Tokyo, Japan, 99/2/1. https://doi.org/10.1109/ECODIM.1999.747688
Warashina K, Kariya Y, Hirata Y, Otsuka M. Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. In Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Institute of Electrical and Electronics Engineers Inc. 1999. p. 626-631. 747688 https://doi.org/10.1109/ECODIM.1999.747688
Warashina, K. ; Kariya, Yoshiharu ; Hirata, Y. ; Otsuka, M. / Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Institute of Electrical and Electronics Engineers Inc., 1999. pp. 626-631
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