| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 1999 Feb 1 |
Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints
Kenji Warashina, Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka
Research output: Contribution to journal › Article › peer-review