Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

Kenji Warashina, Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 1999 Feb 1

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