Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

Kenji Warashina, Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka

Research output: Contribution to journalArticle

Original languageEnglish
JournalDefault journal
Publication statusPublished - 1999 Feb 1

Cite this

Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints. / Warashina, Kenji; Kariya, Yoshiharu; Hirata, Yasunori; Otsuka, Masahisa.

In: Default journal, 01.02.1999.

Research output: Contribution to journalArticle

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AU - Hirata, Yasunori

AU - Otsuka, Masahisa

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