Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Hironori Oota, Shunichi Kikuchi, Hideki Yamabe, Kazuhiko Nakamura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.

Original languageEnglish
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
Publication statusPublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV
Duration: 2010 Jun 22010 Jun 5

Other

Other2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
CityLas Vegas, NV
Period10/6/210/6/5

    Fingerprint

Keywords

  • CSP
  • Mechanical fatigue test
  • Microstructure
  • Sn-Ag-Cu
  • Thermal cycle test

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H., & Nakamura, K. (2010). Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. In 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 [5501291] https://doi.org/10.1109/ITHERM.2010.5501291