Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

K.Doi K.Doi, N.Hirano N.Hirano, M.Mukai M.Mukai, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)103-104
JournalThe 2nd VLSI Packaging Workshop,
Publication statusPublished - 1993 Dec 5

Cite this

K.Doi, K. D., N.Hirano, N. H., M.Mukai, M. M., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1993). Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection, The 2nd VLSI Packaging Workshop, 103-104.

Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection, / K.Doi, K.Doi; N.Hirano, N.Hirano; M.Mukai, M.Mukai; T.Okada, T.Okada; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.

In: The 2nd VLSI Packaging Workshop, 05.12.1993, p. 103-104.

Research output: Contribution to journalArticle

K.Doi, KD, N.Hirano, NH, M.Mukai, MM, T.Okada, TO, Y.Hiruta, YH, T.Sudo, TS & Sudo, T 1993, 'Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,', The 2nd VLSI Packaging Workshop, pp. 103-104.
K.Doi KD, N.Hirano NH, M.Mukai MM, T.Okada TO, Y.Hiruta YH, T.Sudo TS et al. Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection, The 2nd VLSI Packaging Workshop,. 1993 Dec 5;103-104.
K.Doi, K.Doi ; N.Hirano, N.Hirano ; M.Mukai, M.Mukai ; T.Okada, T.Okada ; Y.Hiruta, Y.Hiruta ; T.Sudo, T.Sudo ; Sudo, Toshio. / Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,. In: The 2nd VLSI Packaging Workshop,. 1993 ; pp. 103-104.
@article{dbb94bb8231245beb1189daba4b6b4de,
title = "Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,",
author = "K.Doi K.Doi and N.Hirano N.Hirano and M.Mukai M.Mukai and T.Okada T.Okada and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",
year = "1993",
month = "12",
day = "5",
language = "English",
pages = "103--104",
journal = "The 2nd VLSI Packaging Workshop,",

}

TY - JOUR

T1 - Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - M.Mukai, M.Mukai

AU - T.Okada, T.Okada

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1993/12/5

Y1 - 1993/12/5

M3 - Article

SP - 103

EP - 104

JO - The 2nd VLSI Packaging Workshop,

JF - The 2nd VLSI Packaging Workshop,

ER -