Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

K.Doi K.Doi, N.Hirano N.Hirano, M.Mukai M.Mukai, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)103-104
JournalThe 2nd VLSI Packaging Workshop,
Publication statusPublished - 1993 Dec 5

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