Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

K.Doi K.Doi, N.Hirano N.Hirano, M.Mukai M.Mukai, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	103-104
Journal	The 2nd VLSI Packaging Workshop,
Publication status	Published - 1993 Dec 5

Cite this

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title = "Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,",

author = "K.Doi K.Doi and N.Hirano N.Hirano and M.Mukai M.Mukai and T.Okada T.Okada and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",

year = "1993",

month = dec,

day = "5",

language = "English",

pages = "103--104",

journal = "The 2nd VLSI Packaging Workshop,",

}

TY - JOUR

T1 - Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - M.Mukai, M.Mukai

AU - T.Okada, T.Okada

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1993/12/5

Y1 - 1993/12/5

M3 - Article

SP - 103

EP - 104

JO - The 2nd VLSI Packaging Workshop,

JF - The 2nd VLSI Packaging Workshop,

ER -