Original language | English |
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Pages (from-to) | 103-104 |
Journal | The 2nd VLSI Packaging Workshop, |
Publication status | Published - 1993 Dec 5 |
Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,
K.Doi K.Doi, N.Hirano N.Hirano, M.Mukai M.Mukai, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo
Research output: Contribution to journal › Article › peer-review