Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

Y. K, a a, Y. Kariya

Research output: Contribution to journalArticle

Original languageEnglish
JournalProc. Of International Conference on Electronics Materials and Packaging
VolumeEMAP2011
Publication statusPublished - 2011 Dec 1

Cite this

@article{466e236b083c4242853105b0aa421742,
title = "Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint",
author = "Y. K and a a and Y. Kariya",
year = "2011",
month = "12",
day = "1",
language = "English",
volume = "EMAP2011",
journal = "Proc. Of International Conference on Electronics Materials and Packaging",

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TY - JOUR

T1 - Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

AU - K, Y.

AU - a, a

AU - Kariya, Y.

PY - 2011/12/1

Y1 - 2011/12/1

M3 - Article

VL - EMAP2011

JO - Proc. Of International Conference on Electronics Materials and Packaging

JF - Proc. Of International Conference on Electronics Materials and Packaging

ER -