Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

Research output: Contribution to journal › Article › peer-review

Original language	English
Journal	Proc. Of International Conference on Electronics Materials and Packaging
Volume	EMAP2011
Publication status	Published - 2011 Dec 1

Cite this

@article{466e236b083c4242853105b0aa421742,

title = "Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint",

author = "Y. K and a a and Y. Kariya",

year = "2011",

month = dec,

day = "1",

language = "English",

volume = "EMAP2011",

journal = "Proc. Of International Conference on Electronics Materials and Packaging",

}