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Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect
Kouichi Morooka,
Yoshiharu Kariya
Regional Environment Systems
Department of Materials Science and Engineering
Materials Science and Engineering
Research output
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Contribution to journal
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Article
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peer-review
3
Citations (Scopus)
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Dive into the research topics of 'Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect'. Together they form a unique fingerprint.
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Physics & Astronomy
thermal fatigue
84%
fatigue life
78%
solders
65%
constitutive equations
61%
balls
52%
grids
47%
predictions
31%
intermetallics
22%
cycles
22%
dwell
20%
flux density
13%
creep strength
10%
Engineering & Materials Science
Ball grid arrays
75%
Thermal fatigue
71%
Coarsening
70%
Constitutive equations
63%
Soldering alloys
57%
Creep
50%
Fatigue of materials
40%
Intermetallics
26%
Strain energy
17%
Thermal cycling
9%
Semiconductor materials
7%
Hot Temperature
4%
Chemical Compounds
Thermal Fatigue
100%
Solder
72%
Creep
71%
Intermetallic Compound
26%
Strain Energy
21%
Creep Strength
14%
Thermal Cycling
10%
Semiconductor
6%
Time
6%
Reduction
3%