Thermal stability of platinum bottom electrode for bismuth titanate thin films

Engineering & Materials Science

• Bismuth 100%
• Platinum 87%
• Thermodynamic stability 77%
• Thin films 70%
• Electrodes 57%
• Ferroelectric thin films 43%
• Ferroelectric materials 32%
• Ferroelectric films 22%
• Adhesion 22%
• Electric inductors 15%
• Thick films 15%
• Dielectric properties 15%
• Surface morphology 13%
• Compressive stress 12%
• Grain boundaries 12%
• Tensile stress 12%
• Titanium 12%
• Polarization 11%
• Plastic deformation 11%
• Silicon 9%
• Fabrication 9%
• Substrates 8%
• Microstructure 8%

Physics & Astronomy

• titanates 86%
• bismuth 73%
• platinum 72%
• thermal stability 65%
• electrodes 46%
• thin films 38%
• adhesion 21%
• chokes 18%
• tensile stress 12%
• plastic deformation 10%
• dielectric properties 10%
• titanium 10%
• grain boundaries 9%
• preparation 9%
• fabrication 7%
• microstructure 7%
• silicon 6%
• polarization 6%

Chemical Compounds

• Platinum 54%
• Thermal Stability 49%
• Behavior as Electrode 37%
• Liquid Film 18%
• Plastic Deformation 15%
• Grain Boundary 12%
• Dielectric Property 12%
• Polarization 9%
• Microstructure 8%