Three-dimensional dielectrophoresis with dielectric pillar arrays fabricated by soft lithography

Ryo Watabe, Satoshi Uchida, Hiroyuki Nishikawa

Research output: Contribution to journalArticle

Abstract

We studied 3D dielectrophoretic (DEP) effects induced by dielectric pillar arrays fabricated by soft lithography. Polydimethylsiloxane (PDMS) was casted onto a PMMA mold with arrays of high-aspect-ratio holes micromachined by proton beam writing (PBW), which is a novel direct-write lithographic technique using a scanning proton beam. Arrays of PDMS pillars with diameter of ∼3 μm and a height of ∼15 μm, were fabricated using the soft lithography. The 3D-DEP effect was demonstrated using the PDMS pillar arrays incorporated into a channel on a glass substrate by measuring a trapping capability of E. coli. Coupled use of the soft lithgraphy with the PBW enables us to fabricate low-cost 3D-DEP devices with improved throughput.

Original languageEnglish
Pages (from-to)548-552
Number of pages5
JournalIEEJ Transactions on Fundamentals and Materials
Volume135
Issue number9
DOIs
Publication statusPublished - 2015 Sep 1

Fingerprint

Proton beams
Polydimethylsiloxane
Electrophoresis
Lithography
Escherichia coli
Aspect ratio
Throughput
Scanning
Glass
Substrates
Costs

Keywords

  • Dielectrophoresis
  • Proton beam writing
  • Soft lithography

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Three-dimensional dielectrophoresis with dielectric pillar arrays fabricated by soft lithography. / Watabe, Ryo; Uchida, Satoshi; Nishikawa, Hiroyuki.

In: IEEJ Transactions on Fundamentals and Materials, Vol. 135, No. 9, 01.09.2015, p. 548-552.

Research output: Contribution to journalArticle

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