Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses

Shigeki Matsuo; Keiji Oda; Yoshiki Naoi

doi:10.1109/CLEOPR.2013.6600555

Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses

Shigeki Matsuo, Keiji Oda, Yoshiki Naoi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.

Original language	English
Title of host publication	2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013
DOIs	https://doi.org/10.1109/CLEOPR.2013.6600555
Publication status	Published - 2013 Oct 18
Externally published	Yes
Event	10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013 - Kyoto, Japan Duration: 2013 Jun 30 → 2013 Jul 4

Publication series

Name	Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest

Conference

Conference	10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013
Country/Territory	Japan
City	Kyoto
Period	13/6/30 → 13/7/4

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/CLEOPR.2013.6600555

Cite this

Matsuo, S., Oda, K., & Naoi, Y. (2013). Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. In 2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013 [6600555] (Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest). https://doi.org/10.1109/CLEOPR.2013.6600555

Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. / Matsuo, Shigeki; Oda, Keiji; Naoi, Yoshiki.

2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013. 2013. 6600555 (Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Matsuo, S, Oda, K & Naoi, Y 2013, Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. in 2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013., 6600555, Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest, 10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013, Kyoto, Japan, 13/6/30. https://doi.org/10.1109/CLEOPR.2013.6600555

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title = "Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses",

abstract = "Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.",

author = "Shigeki Matsuo and Keiji Oda and Yoshiki Naoi",

year = "2013",

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doi = "10.1109/CLEOPR.2013.6600555",

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T3 - Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest

BT - 2013 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013

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Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

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