Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses

Shigeki Matsuo, Keiji Oda, Yoshiki Naoi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.

Original languageEnglish
Title of host publicationPacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013 - Kyoto
Duration: 2013 Jun 302013 Jul 4

Other

Other10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013
CityKyoto
Period13/6/3013/7/4

Fingerprint

Silicon
Etching
Laser pulses
etching
Hydrofluoric Acid
Crystalline materials
Hydrofluoric acid
etchants
hydrofluoric acid
nitric acid
silicon
Nitric acid
pulses
lasers
Lasers
Substrates
Processing

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Matsuo, S., Oda, K., & Naoi, Y. (2013). Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. In Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest [6600555] https://doi.org/10.1109/CLEOPR.2013.6600555

Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. / Matsuo, Shigeki; Oda, Keiji; Naoi, Yoshiki.

Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest. 2013. 6600555.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Matsuo, S, Oda, K & Naoi, Y 2013, Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. in Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest., 6600555, 10th Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2013, Kyoto, 13/6/30. https://doi.org/10.1109/CLEOPR.2013.6600555
Matsuo, Shigeki ; Oda, Keiji ; Naoi, Yoshiki. / Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses. Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest. 2013.
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