Three-dimensional MMIC and its application: an ultra-wideband miniature balun

Ichihiko Toyoda, Makoto Hirano, Tsuneo Tokumitsu

    Research output: Contribution to journalArticle

    14 Citations (Scopus)

    Abstract

    A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilayer MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constructed with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chip size. 1.5±1 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 degrees of amplitude and phase balances over 5 to 35 GHz have been obtained. The intrinsic area of the balun is only 450 × 800 μm, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.

    Original languageEnglish
    Pages (from-to)919-924
    Number of pages6
    JournalIEICE Transactions on Electronics
    VolumeE78-C
    Issue number8
    Publication statusPublished - 1995 Aug 1

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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