Three-dimensional MMIC and its application: an ultra-wideband miniature balun

Ichihiko Toyoda, Makoto Hirano, Tsuneo Tokumitsu

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilayer MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constructed with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chip size. 1.5±1 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 degrees of amplitude and phase balances over 5 to 35 GHz have been obtained. The intrinsic area of the balun is only 450 × 800 μm, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.

Original languageEnglish
Pages (from-to)919-924
Number of pages6
JournalIEICE Transactions on Electronics
VolumeE78-C
Issue number8
Publication statusPublished - 1995 Aug
Externally publishedYes

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Monolithic microwave integrated circuits
Ultra-wideband (UWB)
Insertion losses
Wire
Multilayers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Three-dimensional MMIC and its application : an ultra-wideband miniature balun. / Toyoda, Ichihiko; Hirano, Makoto; Tokumitsu, Tsuneo.

In: IEICE Transactions on Electronics, Vol. E78-C, No. 8, 08.1995, p. 919-924.

Research output: Contribution to journalArticle

Toyoda, I, Hirano, M & Tokumitsu, T 1995, 'Three-dimensional MMIC and its application: an ultra-wideband miniature balun', IEICE Transactions on Electronics, vol. E78-C, no. 8, pp. 919-924.
Toyoda, Ichihiko ; Hirano, Makoto ; Tokumitsu, Tsuneo. / Three-dimensional MMIC and its application : an ultra-wideband miniature balun. In: IEICE Transactions on Electronics. 1995 ; Vol. E78-C, No. 8. pp. 919-924.
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