Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors

Koh Inoue, Kenji Kamogawa, Kenjiro Nishikawa, Kenji Ikuta, Kiyomitsu Onodera, Makoto Hirano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper presents a new three-dimensional (3-D) MMIC interconnect process using photosensitive BCB (Benzocyclobutene) interlevel dielectric and STO (SrTiO3) capacitors. This technology significantly reduces process turn-around-time (TAT) and chip size. It yields MMICs with wide frequency range because the low temperature process can be applied to InGaAs and InP devices as well as GaAs and Si devices. A 50 GHz-band amplifier is fabricated to demonstrate this technology.

Original languageEnglish
Title of host publication1998 28th European Microwave Conference, EuMC 1998
PublisherIEEE Computer Society
Pages642-647
Number of pages6
Volume1
DOIs
Publication statusPublished - 1998
Externally publishedYes
Event1998 28th European Microwave Conference, EuMC 1998 - Amsterdam
Duration: 1998 Oct 51998 Oct 9

Other

Other1998 28th European Microwave Conference, EuMC 1998
CityAmsterdam
Period98/10/598/10/9

Fingerprint

Monolithic microwave integrated circuits
Capacitors
Turnaround time
Temperature

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Inoue, K., Kamogawa, K., Nishikawa, K., Ikuta, K., Onodera, K., & Hirano, M. (1998). Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors. In 1998 28th European Microwave Conference, EuMC 1998 (Vol. 1, pp. 642-647). [4139149] IEEE Computer Society. https://doi.org/10.1109/EUMA.1998.338062

Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors. / Inoue, Koh; Kamogawa, Kenji; Nishikawa, Kenjiro; Ikuta, Kenji; Onodera, Kiyomitsu; Hirano, Makoto.

1998 28th European Microwave Conference, EuMC 1998. Vol. 1 IEEE Computer Society, 1998. p. 642-647 4139149.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Inoue, K, Kamogawa, K, Nishikawa, K, Ikuta, K, Onodera, K & Hirano, M 1998, Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors. in 1998 28th European Microwave Conference, EuMC 1998. vol. 1, 4139149, IEEE Computer Society, pp. 642-647, 1998 28th European Microwave Conference, EuMC 1998, Amsterdam, 98/10/5. https://doi.org/10.1109/EUMA.1998.338062
Inoue K, Kamogawa K, Nishikawa K, Ikuta K, Onodera K, Hirano M. Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors. In 1998 28th European Microwave Conference, EuMC 1998. Vol. 1. IEEE Computer Society. 1998. p. 642-647. 4139149 https://doi.org/10.1109/EUMA.1998.338062
Inoue, Koh ; Kamogawa, Kenji ; Nishikawa, Kenjiro ; Ikuta, Kenji ; Onodera, Kiyomitsu ; Hirano, Makoto. / Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors. 1998 28th European Microwave Conference, EuMC 1998. Vol. 1 IEEE Computer Society, 1998. pp. 642-647
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