Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors

Koh Inoue, Kenji Kamogawa, Kenjiro Nishikawa, Kenji Ikuta, Kiyomitsu Onodera, Makoto Hirano

    Research output: Contribution to conference › Paper › peer-review

    6 Citations (Scopus)

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    Engineering & Materials Science