Three-dimensional passive circuit technology for ultra-compact MMICs

Makoto Hirano; Kenjiro Nishikawa; Ichihiko Toyoda; Shinji Aoyama; Suehiro Sugitani; Kimiyoshi Yamasaki

Three-dimensional passive circuit technology for ultra-compact MMICs

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

Research output: Contribution to journal › Conference article › peer-review

Abstract

A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

Original language	English
Pages (from-to)	1447-1450
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	3
Publication status	Published - 1995 Jan 1
Event	Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA Duration: 1995 May 16 → 1995 May 20

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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AU - Hirano, Makoto

AU - Nishikawa, Kenjiro

AU - Toyoda, Ichihiko

AU - Aoyama, Shinji

AU - Sugitani, Suehiro

AU - Yamasaki, Kimiyoshi

PY - 1995/1/1

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N2 - A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

AB - A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

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AN - SCOPUS:0029210125

SN - 0149-645X

VL - 3

SP - 1447

EP - 1450

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

T2 - Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)

Y2 - 16 May 1995 through 20 May 1995

ER -

Three-dimensional passive circuit technology for ultra-compact MMICs

Abstract

ASJC Scopus subject areas

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