Three-dimensional passive circuit technology for ultra-compact MMICs

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

    Research output: Contribution to journalConference article

    Abstract

    A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

    Original languageEnglish
    Pages (from-to)1447-1450
    Number of pages4
    JournalIEEE MTT-S International Microwave Symposium Digest
    Volume3
    Publication statusPublished - 1995 Jan 1
    EventProceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA
    Duration: 1995 May 161995 May 20

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    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

    Cite this

    Hirano, M., Nishikawa, K., Toyoda, I., Aoyama, S., Sugitani, S., & Yamasaki, K. (1995). Three-dimensional passive circuit technology for ultra-compact MMICs. IEEE MTT-S International Microwave Symposium Digest, 3, 1447-1450.