Three-dimensional passive circuit technology for ultra-compact MMICs

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

Original languageEnglish
Title of host publicationIEEE MTT-S International Microwave Symposium Digest
PublisherIEEE
Pages1447-1450
Number of pages4
Volume3
Publication statusPublished - 1995
Externally publishedYes
EventProceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA
Duration: 1995 May 161995 May 20

Other

OtherProceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)
CityOrlando, FL, USA
Period95/5/1695/5/20

Fingerprint

Passive networks
Monolithic microwave integrated circuits
Shielding
shielding
Multilayers
insulators
Metals
metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Hirano, M., Nishikawa, K., Toyoda, I., Aoyama, S., Sugitani, S., & Yamasaki, K. (1995). Three-dimensional passive circuit technology for ultra-compact MMICs. In IEEE MTT-S International Microwave Symposium Digest (Vol. 3, pp. 1447-1450). IEEE.

Three-dimensional passive circuit technology for ultra-compact MMICs. / Hirano, Makoto; Nishikawa, Kenjiro; Toyoda, Ichihiko; Aoyama, Shinji; Sugitani, Suehiro; Yamasaki, Kimiyoshi.

IEEE MTT-S International Microwave Symposium Digest. Vol. 3 IEEE, 1995. p. 1447-1450.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hirano, M, Nishikawa, K, Toyoda, I, Aoyama, S, Sugitani, S & Yamasaki, K 1995, Three-dimensional passive circuit technology for ultra-compact MMICs. in IEEE MTT-S International Microwave Symposium Digest. vol. 3, IEEE, pp. 1447-1450, Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3), Orlando, FL, USA, 95/5/16.
Hirano M, Nishikawa K, Toyoda I, Aoyama S, Sugitani S, Yamasaki K. Three-dimensional passive circuit technology for ultra-compact MMICs. In IEEE MTT-S International Microwave Symposium Digest. Vol. 3. IEEE. 1995. p. 1447-1450
Hirano, Makoto ; Nishikawa, Kenjiro ; Toyoda, Ichihiko ; Aoyama, Shinji ; Sugitani, Suehiro ; Yamasaki, Kimiyoshi. / Three-dimensional passive circuit technology for ultra-compact MMICs. IEEE MTT-S International Microwave Symposium Digest. Vol. 3 IEEE, 1995. pp. 1447-1450
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