Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano, Yuhki Imai, Ichihiko Toyoda, Kenjiro Nishikawa, Masami Tokumitsu, Kazuyoshi Asai

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

Original languageEnglish
Pages (from-to)961-967
Number of pages7
JournalIEICE Transactions on Electronics
VolumeE76-C
Issue number6
Publication statusPublished - 1993 Jun
Externally publishedYes

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hirano, M., Imai, Y., Toyoda, I., Nishikawa, K., Tokumitsu, M., & Asai, K. (1993). Three-dimensional passive elements for compact GaAs MMICs. IEICE Transactions on Electronics, E76-C(6), 961-967.