Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano; Yuhki Imai; Ichihiko Toyoda; Kenjiro Nishikawa; Masami Tokumitsu; Kazuyoshi Asai

Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano, Yuhki Imai, Ichihiko Toyoda, Kenjiro Nishikawa, Masami Tokumitsu, Kazuyoshi Asai

Research output: Contribution to journal › Article › peer-review

Abstract

Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

Original language	English
Pages (from-to)	961-967
Number of pages	7
Journal	IEICE Transactions on Electronics
Volume	E76-C
Issue number	6
Publication status	Published - 1993 Jun 1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

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AU - Hirano, Makoto

AU - Imai, Yuhki

AU - Toyoda, Ichihiko

AU - Nishikawa, Kenjiro

AU - Tokumitsu, Masami

AU - Asai, Kazuyoshi

PY - 1993/6/1

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N2 - Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

AB - Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

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Three-dimensional passive elements for compact GaAs MMICs

Abstract

ASJC Scopus subject areas

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