Three-dimensional routing for multilayer ceramic printed circuit boards

Akihiko Hanafusa, Yasuhiro Yamashita, Mitsuru Yasuda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

An efficient three-dimensional (3-D) routing technique is presented for multilayer ceramic printed circuit (PC) boards. The router can take account of via length as well as pattern length. In the first of the two steps involved, it searches in the direction of via depth from start and end points only. This is called two-and-a-half-dimension (2.5-D) routing. Step two combines 2-D and 3-D routing for wiring not covered in step one. This enables tens of thousands of wires to be routed at 99% effectiveness in less than four hours of CPU time, with all delay conditions satisfied.

Original languageEnglish
Title of host publication1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers
PublisherPubl by IEEE
Pages386-389
Number of pages4
ISBN (Print)0818620552
Publication statusPublished - 1990 Dec 1
Event1990 IEEE International Conference on Computer-Aided Design - ICCAD-90 - Santa Clara, CA, USA
Duration: 1990 Nov 111990 Nov 15

Publication series

Name1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers

Other

Other1990 IEEE International Conference on Computer-Aided Design - ICCAD-90
CitySanta Clara, CA, USA
Period90/11/1190/11/15

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Hanafusa, A., Yamashita, Y., & Yasuda, M. (1990). Three-dimensional routing for multilayer ceramic printed circuit boards. In 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers (pp. 386-389). (1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers). Publ by IEEE.