Three-dimensional routing for multilayer ceramic printed circuit boards

Akihiko Hanafusa, Yasuhiro Yamashita, Mitsuru Yasuda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

An efficient three-dimensional (3-D) routing technique is presented for multilayer ceramic printed circuit (PC) boards. The router can take account of via length as well as pattern length. In the first of the two steps involved, it searches in the direction of via depth from start and end points only. This is called two-and-a-half-dimension (2.5-D) routing. Step two combines 2-D and 3-D routing for wiring not covered in step one. This enables tens of thousands of wires to be routed at 99% effectiveness in less than four hours of CPU time, with all delay conditions satisfied.

Original languageEnglish
Title of host publication1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages386-389
Number of pages4
ISBN (Print)0818620552
Publication statusPublished - 1990
Externally publishedYes
Event1990 IEEE International Conference on Computer-Aided Design - ICCAD-90 - Santa Clara, CA, USA
Duration: 1990 Nov 111990 Nov 15

Other

Other1990 IEEE International Conference on Computer-Aided Design - ICCAD-90
CitySanta Clara, CA, USA
Period90/11/1190/11/15

Fingerprint

Electric wiring
Routers
Printed circuit boards
Program processors
Multilayers
Wire

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Hanafusa, A., Yamashita, Y., & Yasuda, M. (1990). Three-dimensional routing for multilayer ceramic printed circuit boards. In 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers (pp. 386-389). Piscataway, NJ, United States: Publ by IEEE.

Three-dimensional routing for multilayer ceramic printed circuit boards. / Hanafusa, Akihiko; Yamashita, Yasuhiro; Yasuda, Mitsuru.

1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers. Piscataway, NJ, United States : Publ by IEEE, 1990. p. 386-389.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hanafusa, A, Yamashita, Y & Yasuda, M 1990, Three-dimensional routing for multilayer ceramic printed circuit boards. in 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers. Publ by IEEE, Piscataway, NJ, United States, pp. 386-389, 1990 IEEE International Conference on Computer-Aided Design - ICCAD-90, Santa Clara, CA, USA, 90/11/11.
Hanafusa A, Yamashita Y, Yasuda M. Three-dimensional routing for multilayer ceramic printed circuit boards. In 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers. Piscataway, NJ, United States: Publ by IEEE. 1990. p. 386-389
Hanafusa, Akihiko ; Yamashita, Yasuhiro ; Yasuda, Mitsuru. / Three-dimensional routing for multilayer ceramic printed circuit boards. 1990 IEEE International Conference on Computer-Aided Design. Digest of Technical Papers. Piscataway, NJ, United States : Publ by IEEE, 1990. pp. 386-389
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