Tin pest in lead-free solders

Yoshiharu Kariya, Colin Gagg, William J. Plumbridge

Research output: Contribution to journalArticle

42 Citations (Scopus)

Abstract

The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.

Original languageEnglish
Pages (from-to)39-40
Number of pages2
JournalSoldering and Surface Mount Technology
Volume13
Issue number1
DOIs
Publication statusPublished - 2001 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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