Tin pest in lead-free solders

Yoshiharu Kariya, Colin Gagg, William J. Plumbridge

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.

Original languageEnglish
Pages (from-to)39-40
Number of pages2
JournalSoldering and Surface Mount Technology
Volume13
Issue number1
Publication statusPublished - 2001
Externally publishedYes

Fingerprint

Tin
solders
tin
Low temperature effects
lead alloys
Lead alloys
copper alloys
Disintegration
Copper alloys
disintegration
Temperature
temperature effects
Lead
Lead-free solders
temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)
  • Metals and Alloys

Cite this

Kariya, Y., Gagg, C., & Plumbridge, W. J. (2001). Tin pest in lead-free solders. Soldering and Surface Mount Technology, 13(1), 39-40.

Tin pest in lead-free solders. / Kariya, Yoshiharu; Gagg, Colin; Plumbridge, William J.

In: Soldering and Surface Mount Technology, Vol. 13, No. 1, 2001, p. 39-40.

Research output: Contribution to journalArticle

Kariya, Y, Gagg, C & Plumbridge, WJ 2001, 'Tin pest in lead-free solders', Soldering and Surface Mount Technology, vol. 13, no. 1, pp. 39-40.
Kariya, Yoshiharu ; Gagg, Colin ; Plumbridge, William J. / Tin pest in lead-free solders. In: Soldering and Surface Mount Technology. 2001 ; Vol. 13, No. 1. pp. 39-40.
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