Tin Pest in Lead Free Solders

Yoshiharu Kariya, Colin Gagg, William J Plumbridge

Research output: Contribution to journalArticle

41 Citations (Scopus)
Original languageEnglish
Pages (from-to)39-41
JournalSoldering and Surface Mount Technology
Volume13
Publication statusPublished - 2001 Jan 1

Cite this

Kariya, Y., Gagg, C., & Plumbridge, W. J. (2001). Tin Pest in Lead Free Solders. Soldering and Surface Mount Technology, 13, 39-41.

Tin Pest in Lead Free Solders. / Kariya, Yoshiharu; Gagg, Colin; Plumbridge, William J.

In: Soldering and Surface Mount Technology, Vol. 13, 01.01.2001, p. 39-41.

Research output: Contribution to journalArticle

Kariya, Y, Gagg, C & Plumbridge, WJ 2001, 'Tin Pest in Lead Free Solders', Soldering and Surface Mount Technology, vol. 13, pp. 39-41.
Kariya, Yoshiharu ; Gagg, Colin ; Plumbridge, William J. / Tin Pest in Lead Free Solders. In: Soldering and Surface Mount Technology. 2001 ; Vol. 13. pp. 39-41.
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