Tin pest in Sn-0.5 wt.% Cu lead-free solder

Yoshiharu Kariya, N. Williams, C. Gagg, W. Plumbridge

Research output: Contribution to journalArticle

44 Citations (Scopus)

Abstract

Tin pest (the product of the allotropic transformation of βtin into α-tin at temperatures below 286 K) has been observed in a Sn-0.5 wt.% Cu solder alloy. Some 40 percent of the specimen surface was transformed into gray tin after aging at 255K for 1.5 years, and after 1.8 years, the proportion increased to about 70 percent. The degree of transformation in work-hardened areas is much higher than in other areas, suggesting residual stress might provide an additional driving force for the transformation into αtin. The allotropic change results in a 26 percent increase in volume, and cracks are initiated to accommodate the changes in volume. Results indicate that tin pest could lead to total disintegration of micro-electronic solder joints. The tin-copper eutectic system may become a prominent lead-free solder, and tin pest could have major ramifications on service lifetime of electronic assemblies.

Original languageEnglish
Pages (from-to)39-41
Number of pages3
JournalJOM
Volume53
Issue number6
Publication statusPublished - 2001 Jun
Externally publishedYes

Fingerprint

Tin
tin
Soldering alloys
residual stress
Lead-free solders
pest
Disintegration
Microelectronics
Eutectics
Copper
Residual stresses
crack
Aging of materials
copper
Cracks

ASJC Scopus subject areas

  • Geochemistry and Petrology
  • Geotechnical Engineering and Engineering Geology
  • Materials Science(all)
  • Metals and Alloys

Cite this

Kariya, Y., Williams, N., Gagg, C., & Plumbridge, W. (2001). Tin pest in Sn-0.5 wt.% Cu lead-free solder. JOM, 53(6), 39-41.

Tin pest in Sn-0.5 wt.% Cu lead-free solder. / Kariya, Yoshiharu; Williams, N.; Gagg, C.; Plumbridge, W.

In: JOM, Vol. 53, No. 6, 06.2001, p. 39-41.

Research output: Contribution to journalArticle

Kariya, Y, Williams, N, Gagg, C & Plumbridge, W 2001, 'Tin pest in Sn-0.5 wt.% Cu lead-free solder', JOM, vol. 53, no. 6, pp. 39-41.
Kariya Y, Williams N, Gagg C, Plumbridge W. Tin pest in Sn-0.5 wt.% Cu lead-free solder. JOM. 2001 Jun;53(6):39-41.
Kariya, Yoshiharu ; Williams, N. ; Gagg, C. ; Plumbridge, W. / Tin pest in Sn-0.5 wt.% Cu lead-free solder. In: JOM. 2001 ; Vol. 53, No. 6. pp. 39-41.
@article{73392e13807e42e8856497add1ed08c3,
title = "Tin pest in Sn-0.5 wt.{\%} Cu lead-free solder",
abstract = "Tin pest (the product of the allotropic transformation of βtin into α-tin at temperatures below 286 K) has been observed in a Sn-0.5 wt.{\%} Cu solder alloy. Some 40 percent of the specimen surface was transformed into gray tin after aging at 255K for 1.5 years, and after 1.8 years, the proportion increased to about 70 percent. The degree of transformation in work-hardened areas is much higher than in other areas, suggesting residual stress might provide an additional driving force for the transformation into αtin. The allotropic change results in a 26 percent increase in volume, and cracks are initiated to accommodate the changes in volume. Results indicate that tin pest could lead to total disintegration of micro-electronic solder joints. The tin-copper eutectic system may become a prominent lead-free solder, and tin pest could have major ramifications on service lifetime of electronic assemblies.",
author = "Yoshiharu Kariya and N. Williams and C. Gagg and W. Plumbridge",
year = "2001",
month = "6",
language = "English",
volume = "53",
pages = "39--41",
journal = "JOM",
issn = "1047-4838",
publisher = "Minerals, Metals and Materials Society",
number = "6",

}

TY - JOUR

T1 - Tin pest in Sn-0.5 wt.% Cu lead-free solder

AU - Kariya, Yoshiharu

AU - Williams, N.

AU - Gagg, C.

AU - Plumbridge, W.

PY - 2001/6

Y1 - 2001/6

N2 - Tin pest (the product of the allotropic transformation of βtin into α-tin at temperatures below 286 K) has been observed in a Sn-0.5 wt.% Cu solder alloy. Some 40 percent of the specimen surface was transformed into gray tin after aging at 255K for 1.5 years, and after 1.8 years, the proportion increased to about 70 percent. The degree of transformation in work-hardened areas is much higher than in other areas, suggesting residual stress might provide an additional driving force for the transformation into αtin. The allotropic change results in a 26 percent increase in volume, and cracks are initiated to accommodate the changes in volume. Results indicate that tin pest could lead to total disintegration of micro-electronic solder joints. The tin-copper eutectic system may become a prominent lead-free solder, and tin pest could have major ramifications on service lifetime of electronic assemblies.

AB - Tin pest (the product of the allotropic transformation of βtin into α-tin at temperatures below 286 K) has been observed in a Sn-0.5 wt.% Cu solder alloy. Some 40 percent of the specimen surface was transformed into gray tin after aging at 255K for 1.5 years, and after 1.8 years, the proportion increased to about 70 percent. The degree of transformation in work-hardened areas is much higher than in other areas, suggesting residual stress might provide an additional driving force for the transformation into αtin. The allotropic change results in a 26 percent increase in volume, and cracks are initiated to accommodate the changes in volume. Results indicate that tin pest could lead to total disintegration of micro-electronic solder joints. The tin-copper eutectic system may become a prominent lead-free solder, and tin pest could have major ramifications on service lifetime of electronic assemblies.

UR - http://www.scopus.com/inward/record.url?scp=0035359283&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035359283&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0035359283

VL - 53

SP - 39

EP - 41

JO - JOM

JF - JOM

SN - 1047-4838

IS - 6

ER -