| Original language | English |
|---|---|
| Pages (from-to) | 79-85 |
| Number of pages | 7 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 12 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2009 Jan |
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Adhesives
Electronic equipment
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Suganuma, K., Shindo, D., Ohtsuka, K., & Kariya, Y. (2009). Trends of conductive adhesives in electronics. Journal of Japan Institute of Electronics Packaging, 12(1), 79-85. https://doi.org/10.5104/jiep.12.79
Trends of conductive adhesives in electronics. / Suganuma, Katsuaki; Shindo, Daisuke; Ohtsuka, Kanji; Kariya, Yoshiharu.
In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 1, 01.2009, p. 79-85.Research output: Contribution to journal › Article
Suganuma, K, Shindo, D, Ohtsuka, K & Kariya, Y 2009, 'Trends of conductive adhesives in electronics', Journal of Japan Institute of Electronics Packaging, vol. 12, no. 1, pp. 79-85. https://doi.org/10.5104/jiep.12.79
Suganuma K, Shindo D, Ohtsuka K, Kariya Y. Trends of conductive adhesives in electronics. Journal of Japan Institute of Electronics Packaging. 2009 Jan;12(1):79-85. https://doi.org/10.5104/jiep.12.79
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