Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)79-85
Number of pages7
JournalJournal of Japan Institute of Electronics Packaging
Volume12
Issue number1
DOIs
Publication statusPublished - 2009 Jan

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Adhesives
Electronic equipment

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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Trends of conductive adhesives in electronics. / Suganuma, Katsuaki; Shindo, Daisuke; Ohtsuka, Kanji; Kariya, Yoshiharu.

In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 1, 01.2009, p. 79-85.

Research output: Contribution to journalArticle

Suganuma, Katsuaki ; Shindo, Daisuke ; Ohtsuka, Kanji ; Kariya, Yoshiharu. / Trends of conductive adhesives in electronics. In: Journal of Japan Institute of Electronics Packaging. 2009 ; Vol. 12, No. 1. pp. 79-85.
@article{2a8bcb68d2e8476580ed4c8e6efb5bcf,
title = "Trends of conductive adhesives in electronics",
author = "Katsuaki Suganuma and Daisuke Shindo and Kanji Ohtsuka and Yoshiharu Kariya",
year = "2009",
month = "1",
doi = "10.5104/jiep.12.79",
language = "English",
volume = "12",
pages = "79--85",
journal = "Journal of Japan Institute of Electronics Packaging",
issn = "1343-9677",
publisher = "The Japan Institute of Electronics Packaging",
number = "1",

}

TY - JOUR

T1 - Trends of conductive adhesives in electronics

AU - Suganuma, Katsuaki

AU - Shindo, Daisuke

AU - Ohtsuka, Kanji

AU - Kariya, Yoshiharu

PY - 2009/1

Y1 - 2009/1

UR - http://www.scopus.com/inward/record.url?scp=84871077271&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84871077271&partnerID=8YFLogxK

U2 - 10.5104/jiep.12.79

DO - 10.5104/jiep.12.79

M3 - Article

VL - 12

SP - 79

EP - 85

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

SN - 1343-9677

IS - 1

ER -