Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	79-85
Number of pages	7
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	1
DOIs	https://doi.org/10.5104/jiep.12.79
Publication status	Published - 2009 Jan 1

Cite this

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title = "Trends of conductive adhesives in electronics",

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