Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

Research output: Contribution to journal › Article

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)79-85
Number of pages7
JournalJournal of Japan Institute of Electronics Packaging
Volume12
Issue number1
DOIs
Publication statusPublished - 2009 Jan

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Adhesives
Electronic equipment

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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Trends of conductive adhesives in electronics. / Suganuma, Katsuaki; Shindo, Daisuke; Ohtsuka, Kanji; Kariya, Yoshiharu.

In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 1, 01.2009, p. 79-85.

Research output: Contribution to journal › Article

Suganuma, K, Shindo, D, Ohtsuka, K & Kariya, Y 2009, 'Trends of conductive adhesives in electronics', Journal of Japan Institute of Electronics Packaging, vol. 12, no. 1, pp. 79-85. https://doi.org/10.5104/jiep.12.79
Suganuma K, Shindo D, Ohtsuka K, Kariya Y. Trends of conductive adhesives in electronics. Journal of Japan Institute of Electronics Packaging. 2009 Jan;12(1):79-85. https://doi.org/10.5104/jiep.12.79
Suganuma, Katsuaki ; Shindo, Daisuke ; Ohtsuka, Kanji ; Kariya, Yoshiharu. / Trends of conductive adhesives in electronics. In: Journal of Japan Institute of Electronics Packaging. 2009 ; Vol. 12, No. 1. pp. 79-85.
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