Trends of conductive adhesives in electronics

Katsuaki Suganuma; Daisuke Shindo; Kanji Ohtsuka; Yoshiharu Kariya

doi:10.5104/jiep.12.79

Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	79-85
Number of pages	7
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	1
DOIs	https://doi.org/10.5104/jiep.12.79
Publication status	Published - 2009 Jan

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.5104/jiep.12.79

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@article{2a8bcb68d2e8476580ed4c8e6efb5bcf,

title = "Trends of conductive adhesives in electronics",

author = "Katsuaki Suganuma and Daisuke Shindo and Kanji Ohtsuka and Yoshiharu Kariya",

year = "2009",

month = jan,

doi = "10.5104/jiep.12.79",

language = "English",

volume = "12",

pages = "79--85",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "1",

}

TY - JOUR

T1 - Trends of conductive adhesives in electronics

AU - Suganuma, Katsuaki

AU - Shindo, Daisuke

AU - Ohtsuka, Kanji

AU - Kariya, Yoshiharu

PY - 2009/1

Y1 - 2009/1

UR - http://www.scopus.com/inward/record.url?scp=84871077271&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84871077271&partnerID=8YFLogxK

U2 - 10.5104/jiep.12.79

DO - 10.5104/jiep.12.79

M3 - Article

AN - SCOPUS:84871077271

VL - 12

SP - 79

EP - 85

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

SN - 1343-9677

IS - 1

ER -

Trends of conductive adhesives in electronics

ASJC Scopus subject areas

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