Abstract
The forming process in planar-type Cu2O-based resistive switching devices is investigated. It is found that two forming processes occur in series, and the existence of a Cu filament is directly confirmed using transmission electron microscopy after each forming process. The time evolution of the surface is observed by an optical microscope during these processes. The first process accompanies the oxidation of the Cu2O surface, and the filament is created ∼15 μm below the surface; the second process involves melting of the region between the electrodes with the creation of a new filament ∼1 μm below the surface.
| Original language | English |
|---|---|
| Journal | Applied Physics Express |
| Volume | 4 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2011 May |
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ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)
Cite this
Two-step forming process in planar-type Cu2O-based resistive switching devices. / Suzuki, Kazunori; Igarashi, Norihide; Kyuno, Kentaro.
In: Applied Physics Express, Vol. 4, No. 5, 05.2011.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Two-step forming process in planar-type Cu2O-based resistive switching devices
AU - Suzuki, Kazunori
AU - Igarashi, Norihide
AU - Kyuno, Kentaro
PY - 2011/5
Y1 - 2011/5
N2 - The forming process in planar-type Cu2O-based resistive switching devices is investigated. It is found that two forming processes occur in series, and the existence of a Cu filament is directly confirmed using transmission electron microscopy after each forming process. The time evolution of the surface is observed by an optical microscope during these processes. The first process accompanies the oxidation of the Cu2O surface, and the filament is created ∼15 μm below the surface; the second process involves melting of the region between the electrodes with the creation of a new filament ∼1 μm below the surface.
AB - The forming process in planar-type Cu2O-based resistive switching devices is investigated. It is found that two forming processes occur in series, and the existence of a Cu filament is directly confirmed using transmission electron microscopy after each forming process. The time evolution of the surface is observed by an optical microscope during these processes. The first process accompanies the oxidation of the Cu2O surface, and the filament is created ∼15 μm below the surface; the second process involves melting of the region between the electrodes with the creation of a new filament ∼1 μm below the surface.
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UR - http://www.scopus.com/inward/citedby.url?scp=79956076515&partnerID=8YFLogxK
U2 - 10.1143/APEX.4.051801
DO - 10.1143/APEX.4.051801
M3 - Article
VL - 4
JO - Applied Physics Express
JF - Applied Physics Express
SN - 1882-0778
IS - 5
ER -