| Original language | English |
|---|---|
| Pages (from-to) | 59-60 |
| Journal | 1997 Symposium on VLSI Technology Digest of Technical Papers |
| Publication status | Published - 1997 Jun 1 |
Cite this
Y.Tsuychiya, Y. T., K.Ueno, K. U., V.M.Donnelly, V. M. D., T.Kikkawa, T. K., Y.Hayashi, Y. H., A.Kobayashi, A. K., A.Skiguchi, A. S., & Ueno, K. (1997). Ultra-low resistance direct contact Cu via technology using in-situ chemical vapor cleaning. 1997 Symposium on VLSI Technology Digest of Technical Papers, 59-60.