Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Heiji Yasui, Yuki Yamamoto, Takekazu Sawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

Original languageEnglish
Title of host publicationEUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology
Publishereuspen
Pages599-602
Number of pages4
Publication statusPublished - 2005
Externally publishedYes
Event5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier
Duration: 2005 May 82005 May 11

Other

Other5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005
CityMontpellier
Period05/5/805/5/11

Fingerprint

grinding
Silicon carbide
silicon carbides
ceramics
Diamond
Diamonds
Wheels
Metals
wheels
grain size
diamonds
metals
silicon carbide

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Materials Science(all)
  • Environmental Engineering
  • Instrumentation

Cite this

Yasui, H., Yamamoto, Y., & Sawa, T. (2005). Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. In EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology (pp. 599-602). euspen.

Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. / Yasui, Heiji; Yamamoto, Yuki; Sawa, Takekazu.

EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology. euspen, 2005. p. 599-602.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yasui, H, Yamamoto, Y & Sawa, T 2005, Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. in EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology. euspen, pp. 599-602, 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005, Montpellier, 05/5/8.
Yasui H, Yamamoto Y, Sawa T. Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. In EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology. euspen. 2005. p. 599-602
Yasui, Heiji ; Yamamoto, Yuki ; Sawa, Takekazu. / Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology. euspen, 2005. pp. 599-602
@inproceedings{8f1461a8fe1046808cd47485d1b24488,
title = "Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm",
abstract = "In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.",
author = "Heiji Yasui and Yuki Yamamoto and Takekazu Sawa",
year = "2005",
language = "English",
pages = "599--602",
booktitle = "EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology",
publisher = "euspen",

}

TY - GEN

T1 - Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

AU - Yasui, Heiji

AU - Yamamoto, Yuki

AU - Sawa, Takekazu

PY - 2005

Y1 - 2005

N2 - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

AB - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

UR - http://www.scopus.com/inward/record.url?scp=84884766487&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84884766487&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84884766487

SP - 599

EP - 602

BT - EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology

PB - euspen

ER -