Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Heiji Yasui, Yuki Yamamoto, Takekazu Sawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

Original languageEnglish
Title of host publicationEUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology
Publishereuspen
Pages599-602
Number of pages4
Publication statusPublished - 2005
Externally publishedYes
Event5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier
Duration: 2005 May 82005 May 11

Other

Other5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005
CityMontpellier
Period05/5/805/5/11

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ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Materials Science(all)
  • Environmental Engineering
  • Instrumentation

Cite this

Yasui, H., Yamamoto, Y., & Sawa, T. (2005). Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. In EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology (pp. 599-602). euspen.