Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system

Katsuya Kikuchi, Chihiro Ueda, Toshio Gomyo, Toshikazu Ookubo, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the ultralow impedance evaluation system that has a high measurement dynamic range at the entire measurable frequency band can be realized. Furthermore, by using 2.5-D and 3-D FEM electromagnetic field simulator, it is expected that the accurate and wideband comparative verification of the PDN impedance analysis and evaluation can be realized.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1033-1039
Number of pages7
DOIs
Publication statusPublished - 2012
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA
Duration: 2012 May 292012 Jun 1

Other

Other2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
CitySan Diego, CA
Period12/5/2912/6/1

Fingerprint

Electric power distribution
Capacitors
Electromagnetic fields
Simulators
Finite element method
Silicon
Frequency bands

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kikuchi, K., Ueda, C., Gomyo, T., Ookubo, T., Aoyagi, M., Sudo, T., & Otsuka, K. (2012). Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference (pp. 1033-1039). [6248963] https://doi.org/10.1109/ECTC.2012.6248963

Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. / Kikuchi, Katsuya; Ueda, Chihiro; Gomyo, Toshio; Ookubo, Toshikazu; Aoyagi, Masahiro; Sudo, Toshio; Otsuka, Kanji.

Proceedings - Electronic Components and Technology Conference. 2012. p. 1033-1039 6248963.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kikuchi, K, Ueda, C, Gomyo, T, Ookubo, T, Aoyagi, M, Sudo, T & Otsuka, K 2012, Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. in Proceedings - Electronic Components and Technology Conference., 6248963, pp. 1033-1039, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012, San Diego, CA, 12/5/29. https://doi.org/10.1109/ECTC.2012.6248963
Kikuchi K, Ueda C, Gomyo T, Ookubo T, Aoyagi M, Sudo T et al. Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference. 2012. p. 1033-1039. 6248963 https://doi.org/10.1109/ECTC.2012.6248963
Kikuchi, Katsuya ; Ueda, Chihiro ; Gomyo, Toshio ; Ookubo, Toshikazu ; Aoyagi, Masahiro ; Sudo, Toshio ; Otsuka, Kanji. / Ultralow impedance analysis and evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system. Proceedings - Electronic Components and Technology Conference. 2012. pp. 1033-1039
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