| Original language | English |
|---|---|
| Pages (from-to) | 119-121 |
| Journal | Proceedings of 1998 International Interconnect Technology Conference |
| Publication status | Published - 1998 Jun 1 |
Cite this
K.Ueno, K. U., A.Sekiguchi, A. S., A.Kobayashi, A. K., & Ueno, K. (1998). Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. Proceedings of 1998 International Interconnect Technology Conference, 119-121.
Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. / K.Ueno, K.Ueno; A.Sekiguchi, A.Sekiguchi; A.Kobayashi, A.Kobayashi; Ueno, Kazuyoshi.
In: Proceedings of 1998 International Interconnect Technology Conference, 01.06.1998, p. 119-121.Research output: Contribution to journal › Article
K.Ueno, KU, A.Sekiguchi, AS, A.Kobayashi, AK & Ueno, K 1998, 'Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer', Proceedings of 1998 International Interconnect Technology Conference, pp. 119-121.
K.Ueno KU, A.Sekiguchi AS, A.Kobayashi AK, Ueno K. Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. Proceedings of 1998 International Interconnect Technology Conference. 1998 Jun 1;119-121.
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title = "Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer",
author = "K.Ueno K.Ueno and A.Sekiguchi A.Sekiguchi and A.Kobayashi A.Kobayashi and Kazuyoshi Ueno",
year = "1998",
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AU - A.Sekiguchi, A.Sekiguchi
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AU - Ueno, Kazuyoshi
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JO - Proceedings of 1998 International Interconnect Technology Conference
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