Original language | English |
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Pages (from-to) | 119-121 |
Journal | Proceedings of 1998 International Interconnect Technology Conference |
Publication status | Published - 1998 Jun 1 |
Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer
K.Ueno K.Ueno, A.Sekiguchi A.Sekiguchi, A.Kobayashi A.Kobayashi, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review
14
Citations
(Scopus)