Water vapor-controlled thermal plasma chemical vapor deposition of double-layered TiN/PSZ coatings on Si and WC-Co substrates

Takanori Sakamoto; Shiro Shimada; Hajime Kiyono; Jiro Tsujino; Isao Yamazaki

doi:10.1016/j.mseb.2010.05.010

Water vapor-controlled thermal plasma chemical vapor deposition of double-layered TiN/PSZ coatings on Si and WC-Co substrates

Takanori Sakamoto, Shiro Shimada, Hajime Kiyono, Jiro Tsujino, Isao Yamazaki

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Double-layer TiN/PSZ film coatings were deposited on Si wafers and WC-Co cutting tools from Ti-, Zr-, and Y-alkoxide solutions by thermal plasma chemical vapor deposition (CVD) containing water vapor. The partially stabilized zirconia (PSZ) layer was coated on a TiN film by oxidation of Zr- and Y-alkoxides with H₂O supplied by both constant and step-wise methods. Double-layer TiN/PSZ coatings deposited on Si wafers and WC-Co by the two H₂O supply methods were approximately 2 μm thick. TEM observation showed that the interface between the TiN and PSZ in the double-layer TiN/PSZ formed by the step-wise H₂O supply is more adhesive than under constant H₂O supply. Double-layer TiN/PSZ films coated on WC-Co substrates by the step-wise supply exhibited good crater wear resistance, comparable to a commercial double-layer TiN/Al₂O₃ coating by thermal CVD.

Original language	English
Pages (from-to)	201-206
Number of pages	6
Journal	Materials Science and Engineering B: Solid-State Materials for Advanced Technology
Volume	172
Issue number	2
DOIs	https://doi.org/10.1016/j.mseb.2010.05.010
Publication status	Published - 2010 Aug 25
Externally published	Yes

Keywords

Chemical vapor deposition
Partial stabilized zirconia
Thermal plasma
Thin films
Wear resistance

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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Water vapor-controlled thermal plasma chemical vapor deposition of double-layered TiN/PSZ coatings on Si and WC-Co substrates. / Sakamoto, Takanori; Shimada, Shiro; Kiyono, Hajime; Tsujino, Jiro; Yamazaki, Isao.

In: Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol. 172, No. 2, 25.08.2010, p. 201-206.

Research output: Contribution to journal › Article › peer-review

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title = "Water vapor-controlled thermal plasma chemical vapor deposition of double-layered TiN/PSZ coatings on Si and WC-Co substrates",

abstract = "Double-layer TiN/PSZ film coatings were deposited on Si wafers and WC-Co cutting tools from Ti-, Zr-, and Y-alkoxide solutions by thermal plasma chemical vapor deposition (CVD) containing water vapor. The partially stabilized zirconia (PSZ) layer was coated on a TiN film by oxidation of Zr- and Y-alkoxides with H2O supplied by both constant and step-wise methods. Double-layer TiN/PSZ coatings deposited on Si wafers and WC-Co by the two H2O supply methods were approximately 2 μm thick. TEM observation showed that the interface between the TiN and PSZ in the double-layer TiN/PSZ formed by the step-wise H2O supply is more adhesive than under constant H2O supply. Double-layer TiN/PSZ films coated on WC-Co substrates by the step-wise supply exhibited good crater wear resistance, comparable to a commercial double-layer TiN/Al2O3 coating by thermal CVD.",

keywords = "Chemical vapor deposition, Partial stabilized zirconia, Thermal plasma, Thin films, Wear resistance",

author = "Takanori Sakamoto and Shiro Shimada and Hajime Kiyono and Jiro Tsujino and Isao Yamazaki",

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AU - Sakamoto, Takanori

AU - Shimada, Shiro

AU - Kiyono, Hajime

AU - Tsujino, Jiro

AU - Yamazaki, Isao

PY - 2010/8/25

Y1 - 2010/8/25

N2 - Double-layer TiN/PSZ film coatings were deposited on Si wafers and WC-Co cutting tools from Ti-, Zr-, and Y-alkoxide solutions by thermal plasma chemical vapor deposition (CVD) containing water vapor. The partially stabilized zirconia (PSZ) layer was coated on a TiN film by oxidation of Zr- and Y-alkoxides with H2O supplied by both constant and step-wise methods. Double-layer TiN/PSZ coatings deposited on Si wafers and WC-Co by the two H2O supply methods were approximately 2 μm thick. TEM observation showed that the interface between the TiN and PSZ in the double-layer TiN/PSZ formed by the step-wise H2O supply is more adhesive than under constant H2O supply. Double-layer TiN/PSZ films coated on WC-Co substrates by the step-wise supply exhibited good crater wear resistance, comparable to a commercial double-layer TiN/Al2O3 coating by thermal CVD.

AB - Double-layer TiN/PSZ film coatings were deposited on Si wafers and WC-Co cutting tools from Ti-, Zr-, and Y-alkoxide solutions by thermal plasma chemical vapor deposition (CVD) containing water vapor. The partially stabilized zirconia (PSZ) layer was coated on a TiN film by oxidation of Zr- and Y-alkoxides with H2O supplied by both constant and step-wise methods. Double-layer TiN/PSZ coatings deposited on Si wafers and WC-Co by the two H2O supply methods were approximately 2 μm thick. TEM observation showed that the interface between the TiN and PSZ in the double-layer TiN/PSZ formed by the step-wise H2O supply is more adhesive than under constant H2O supply. Double-layer TiN/PSZ films coated on WC-Co substrates by the step-wise supply exhibited good crater wear resistance, comparable to a commercial double-layer TiN/Al2O3 coating by thermal CVD.

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