Water vapor-controlled thermal plasma chemical vapor deposition of double-layered TiN/PSZ coatings on Si and WC-Co substrates

Takanori Sakamoto, Shiro Shimada, Hajime Kiyono, Jiro Tsujino, Isao Yamazaki

Research output: Contribution to journalArticle

3 Citations (Scopus)


Double-layer TiN/PSZ film coatings were deposited on Si wafers and WC-Co cutting tools from Ti-, Zr-, and Y-alkoxide solutions by thermal plasma chemical vapor deposition (CVD) containing water vapor. The partially stabilized zirconia (PSZ) layer was coated on a TiN film by oxidation of Zr- and Y-alkoxides with H2O supplied by both constant and step-wise methods. Double-layer TiN/PSZ coatings deposited on Si wafers and WC-Co by the two H2O supply methods were approximately 2 μm thick. TEM observation showed that the interface between the TiN and PSZ in the double-layer TiN/PSZ formed by the step-wise H2O supply is more adhesive than under constant H2O supply. Double-layer TiN/PSZ films coated on WC-Co substrates by the step-wise supply exhibited good crater wear resistance, comparable to a commercial double-layer TiN/Al2O3 coating by thermal CVD.

Original languageEnglish
Pages (from-to)201-206
Number of pages6
JournalMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Issue number2
Publication statusPublished - 2010 Aug 25



  • Chemical vapor deposition
  • Partial stabilized zirconia
  • Thermal plasma
  • Thin films
  • Wear resistance

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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