TY - JOUR
T1 - Why are hydrogen ions best for MeV ion beam lithography?
AU - Norarat, Rattanaporn
AU - Puttaraksa, Nitipon
AU - Napari, Mari
AU - Ananda Sagari, A. R.
AU - Laitinen, Mikko
AU - Sajavaara, Timo
AU - Yotprayoonsak, Peerapong
AU - Pettersson, Mika
AU - Chienthavorn, Orapin
AU - Whitlow, Harry J.
N1 - Funding Information:
This work was supported the Academy of Finland, Centre of Excellence in Nuclear and Accelerator Based Physics, Ref. 213503 and Grant 129999. OC was supported by the Center of Excellence for Innovation in Chemistry (PERCH-CIC), Commission on Higher Education, Ministry of Education of Thailand.
PY - 2013/2
Y1 - 2013/2
N2 - The exposure characteristics of poly-(methyl methacrylate) (PMMA) for 2 MeV 1H +, 3 MeV 4He 2+ and 6 MeV 12C 3+ have been investigated. The samples were characterised using Atomic Force Microscopy (AFM), optical microscopy and Raman spectroscopy. Development was carried out using a 7:3 propan-2-ol:H 2O mixture to determine clearing and cross-linking fluences. It was found that protons had a considerably wider tolerance to exposure variations and a smaller span of doses within the ion track. Furthermore, the void formation and consequent stress-induced surface roughening were smaller for protons. For all ions, the CC bond Raman signal increased continuously with dose and fluence, even well above that required for total cross linking.
AB - The exposure characteristics of poly-(methyl methacrylate) (PMMA) for 2 MeV 1H +, 3 MeV 4He 2+ and 6 MeV 12C 3+ have been investigated. The samples were characterised using Atomic Force Microscopy (AFM), optical microscopy and Raman spectroscopy. Development was carried out using a 7:3 propan-2-ol:H 2O mixture to determine clearing and cross-linking fluences. It was found that protons had a considerably wider tolerance to exposure variations and a smaller span of doses within the ion track. Furthermore, the void formation and consequent stress-induced surface roughening were smaller for protons. For all ions, the CC bond Raman signal increased continuously with dose and fluence, even well above that required for total cross linking.
KW - AFM
KW - Chain-scission
KW - MeV ion beam lithography
KW - PMMA
KW - Raman spectroscopy
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U2 - 10.1016/j.mee.2012.02.012
DO - 10.1016/j.mee.2012.02.012
M3 - Article
AN - SCOPUS:84869082485
SN - 0167-9317
VL - 102
SP - 22
EP - 24
JO - Microelectronic Engineering
JF - Microelectronic Engineering
ER -