Wideband and high-isolation properties of power bus structure by the combination of thin-film embedded capacitor and planar EBG structure

Toshio Sudo, Seiju Ichijo, Takanobu Kushihira

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Power bus structure in a printed circuit board (PCB) is an influential design parameter in mitigating power/ground fluctuation and radiated emission for high-speed digital circuits. The power bus is ordinarily composed of two solid planes separated by dielectric insulator in a multilayer PCB. Recently, it has been reported that an electromagnetic bandgap (EBG)-type VDD plane is effective for suppressing radiated emission for mixed-signal applications or high-speed digital applications. However, the EBG-type VDD plane often induces large power/ground bounce due to the return current discontinuity. On the other hand, the solid-type VDD and ground plane with a thinner dielectric insulator makes wide band property of the power supply impedance by eliminating the power/ground resonances. However, even adopting an insulator thickness of 16 um, the S21 property was still around -50 dB or so. In the present work, the power bus structure with wideband and high isolation properties of around -80 dB or more has been explored by the combination of thin-film insulator and planar EBG structure.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1212-1217
Number of pages6
DOIs
Publication statusPublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV
Duration: 2007 May 292007 Jun 1

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CitySparks, NV
Period07/5/2907/6/1

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sudo, T., Ichijo, S., & Kushihira, T. (2007). Wideband and high-isolation properties of power bus structure by the combination of thin-film embedded capacitor and planar EBG structure. In Proceedings - Electronic Components and Technology Conference (pp. 1212-1217). [4250034] https://doi.org/10.1109/ECTC.2007.373948