Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system

Katsuya Kikuchi, Toshio Gomyo, Toshikazu Ookubo, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated various types of capacitor mounted or capacitor embedded interposers test element group (TEG), such as surface-mounted and embedded chip capacitors, and thin film capacitors on silicon interposers using the same simple design to compare measurement results with calculation ones. As a result, the ultralow impedance evaluation system that has a high measurement dynamic range at the entire measurable frequency band can be realized. Furthermore, by using 2.5-D and 3-D FEM electromagnetic field simulator, it is expected that the accurate and wideband comparative verification of the PDN impedance analysis and evaluation can be realized.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1190-1196
Number of pages7
DOIs
Publication statusPublished - 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV
Duration: 2013 May 282013 May 31

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CityLas Vegas, NV
Period13/5/2813/5/31

Fingerprint

Electric power distribution
Capacitors
Electromagnetic fields
Simulators
Finite element method
Silicon
Frequency bands

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kikuchi, K., Gomyo, T., Ookubo, T., Aoyagi, M., Sudo, T., & Otsuka, K. (2013). Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference (pp. 1190-1196). [6575726] https://doi.org/10.1109/ECTC.2013.6575726

Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system. / Kikuchi, Katsuya; Gomyo, Toshio; Ookubo, Toshikazu; Aoyagi, Masahiro; Sudo, Toshio; Otsuka, Kanji.

Proceedings - Electronic Components and Technology Conference. 2013. p. 1190-1196 6575726.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kikuchi, K, Gomyo, T, Ookubo, T, Aoyagi, M, Sudo, T & Otsuka, K 2013, Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system. in Proceedings - Electronic Components and Technology Conference., 6575726, pp. 1190-1196, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, 13/5/28. https://doi.org/10.1109/ECTC.2013.6575726
Kikuchi K, Gomyo T, Ookubo T, Aoyagi M, Sudo T, Otsuka K. Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system. In Proceedings - Electronic Components and Technology Conference. 2013. p. 1190-1196. 6575726 https://doi.org/10.1109/ECTC.2013.6575726
Kikuchi, Katsuya ; Gomyo, Toshio ; Ookubo, Toshikazu ; Aoyagi, Masahiro ; Sudo, Toshio ; Otsuka, Kanji. / Wideband ultralow power distribution network impedance evaluation of decoupling capacitor embedded interposers for 3-D integrated LSI system. Proceedings - Electronic Components and Technology Conference. 2013. pp. 1190-1196
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