年単位の研究成果
研究成果
2018
2014
Reducing signal transmission loss by low surface roughness
Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.研究成果: Paper
Signal transmission loss due to copper surface roughness in high-frequency region
Liew, E., Malaysia, M. C. F., Malaysia, S. A., Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.研究成果: Paper
4
引用
（Scopus）
2013
Power integrity behavior for various packaging environments
Terasaki, M., Kiyosige, S., Ichimura, W., Kobayashi, R., Kubo, G., Otsuka, H. & Sudo, T., 2013 1 1.研究成果: Paper
2
引用
（Scopus）
Ultra-wideband noise suppression of power supply noise by combining mushroom and planar type EBG structures
Ikemiya, K., Sakai, M. & Sudo, T., 2013 1 1.研究成果: Paper
1
引用
（Scopus）
2005
Interferometric optical isolator with Si gudiing layer operated in unidirectional magnetic field
Yokoi, H., 2005 12 1, p. 450-457. 8 p.研究成果: Paper
Reliability of damascene copper interconnects
Ueno, K., Ishigarni, T., Kakuhara, Y. & Kawano, M., 2005 12 1, p. 408-418. 11 p.研究成果: Paper
1
引用
（Scopus）
2003
TE-TM Mode conversion optical isolator fabricated by wafer bonding
Yokoi, H., Mizumoto, T. & Iwasaki, H., 2003 12 1, p. 130-136. 7 p.研究成果: Paper
2002
Physical properties of MOD derived Bi4Ti3O12/Bi2SiO5/Si structures
Yamaguchi, M., Nagatomo, T. & Masuda, Y., 2002, p. 231-234. 4 p.研究成果: Paper
3
引用
（Scopus）
2000
Fabrication and properties of Bi2SiO5 thin films for MFIS structures
Yamaguchi, M., Hiraki, K., Homma, T., Nagatomo, T. & Masuda, Y., 2000, p. 629-632. 4 p.研究成果: Paper
3
引用
（Scopus）
1998
Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd3Ga5O12
Yokoi, H. & Mizumoto, T., 1998 1 1. 1 p.研究成果: Paper
1988
New polyimide siloxane film for interlayer dielectrics in sub-micron multilevel interconnection.
Homma, T., Eguchi, K., Numasawa, Y., Kikkawa, T., Hokari, Y. & Hamano, K., 1988, p. 279-285. 7 p.研究成果: Paper
6
引用
（Scopus）