電子工学科

研究成果

年別の研究成果 1984 2021

• 230 Article
• 165 Conference contribution
• 21 Conference article
• 12 Paper
• 10 その他
  • 4 Book
  • 3 Editorial
  • 2 Chapter
  • 1 Comment/debate

年別の研究成果

年別の研究成果

検索結果

• 2018

  Word Level Language Identification of Code Mixing Text in Social Media

  Premachandra, C., 2018 12.

  研究成果: Paper › 査読
• 2014

  Reducing signal transmission loss by low surface roughness

  Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.

  研究成果: Paper › 査読

  • Surface roughness
  • Copper
  • Metal foil
  • Printed circuit boards
  • Dielectric losses

• Signal transmission loss due to copper surface roughness in high-frequency region

  Liew, E., Malaysia, M. C. F., Malaysia, S. A., Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.

  研究成果: Paper › 査読

  • Surface roughness
  • Copper
  • Metal foil
  • Printed circuit boards
  • Dielectric losses
  4 被引用数 (Scopus)
• 2013

  Power integrity behavior for various packaging environments

  Terasaki, M., Kiyosige, S., Ichimura, W., Kobayashi, R., Kubo, G., Otsuka, H. & Sudo, T., 2013 1 1.

  研究成果: Paper › 査読

  • Electric power distribution
  • Packaging
  • Acoustic impedance
  • Inductance
  • Networks (circuits)
  2 被引用数 (Scopus)

• Ultra-wideband noise suppression of power supply noise by combining mushroom and planar type EBG structures

  Ikemiya, K., Sakai, M. & Sudo, T., 2013 1 1.

  研究成果: Paper › 査読

  • Energy gap
  • Ultra-wideband (UWB)
  • Digital circuits
  • Printed circuit boards
  • Clocks
  1 被引用数 (Scopus)
• 2005

  Interferometric optical isolator with Si gudiing layer operated in unidirectional magnetic field

  Yokoi, H., 2005 12 1, p. 450-457. 8 p.

  研究成果: Paper › 査読

  • Interferometers
  • Magnetic fields
  • Magnetooptical effects
  • Garnets
  • Wafer bonding

• Reliability of damascene copper interconnects

  Ueno, K., Ishigarni, T., Kakuhara, Y. & Kawano, M., 2005 12 1, p. 408-418. 11 p.

  研究成果: Paper › 査読

  • Copper
  • Electromigration
  • Electroless plating
  • Palladium
  • Metals
  1 被引用数 (Scopus)
• 2003

  TE-TM Mode conversion optical isolator fabricated by wafer bonding

  Yokoi, H., Mizumoto, T. & Iwasaki, H., 2003 12 1, p. 130-136. 7 p.

  研究成果: Paper › 査読

  • Garnets
  • Wafer bonding
  • Waveguides
  • Magnetooptical effects
  • Phase matching
• 2002

  Physical properties of MOD derived Bi₄Ti₃O₁₂/Bi₂SiO₅/Si structures

  Yamaguchi, M., Nagatomo, T. & Masuda, Y., 2002, p. 231-234. 4 p.

  研究成果: Paper › 査読

  • Buffer layers
  • Thin films
  • Physical properties
  • Bismuth
  • Metals
  3 被引用数 (Scopus)
• 2000

  Fabrication and properties of Bi₂SiO₅ thin films for MFIS structures

  Yamaguchi, M., Hiraki, K., Homma, T., Nagatomo, T. & Masuda, Y., 2000, p. 629-632. 4 p.

  研究成果: Paper › 査読

  • Ferroelectric materials
  • Thin films
  • Semiconductor materials
  • Metals
  • Fabrication
  4 被引用数 (Scopus)
• 1998

  Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd₃Ga₅O₁₂

  Yokoi, H. & Mizumoto, T., 1998 1 1. 1 p.

  研究成果: Paper › 査読

  • Heat treatment
  • Temperature
  • Wet etching
  • Semiconductor lasers
  • Annealing
• 1988

  New polyimide siloxane film for interlayer dielectrics in sub-micron multilevel interconnection.

  Homma, T., Eguchi, K., Numasawa, Y., Kikkawa, T., Hokari, Y. & Hamano, K., 1988, p. 279-285. 7 p.

  研究成果: Paper › 査読

  • Polyimides
  • Plasma CVD
  • Chemical bonds
  • Leakage currents
  • Thermal expansion
  6 被引用数 (Scopus)