電子工学科

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Fabrication and properties of Bi2SiO5 thin films for MFIS structures

Yamaguchi, M., Hiraki, K., Homma, T., Nagatomo, T. & Masuda, Y., 2000, p. 629-632. 4 p.

研究成果: Paper

3 引用 (Scopus)

New polyimide siloxane film for interlayer dielectrics in sub-micron multilevel interconnection.

Homma, T., Eguchi, K., Numasawa, Y., Kikkawa, T., Hokari, Y. & Hamano, K., 1988, p. 279-285. 7 p.

研究成果: Paper

6 引用 (Scopus)

Physical properties of MOD derived Bi4Ti3O12/Bi2SiO5/Si structures

Yamaguchi, M., Nagatomo, T. & Masuda, Y., 2002, p. 231-234. 4 p.

研究成果: Paper

3 引用 (Scopus)

Power integrity behavior for various packaging environments

Terasaki, M., Kiyosige, S., Ichimura, W., Kobayashi, R., Kubo, G., Otsuka, H. & Sudo, T., 2013 1 1.

研究成果: Paper

2 引用 (Scopus)

Reducing signal transmission loss by low surface roughness

Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.

研究成果: Paper

Reliability of damascene copper interconnects

Ueno, K., Ishigarni, T., Kakuhara, Y. & Kawano, M., 2005 12 1, p. 408-418. 11 p.

研究成果: Paper

1 引用 (Scopus)

Signal transmission loss due to copper surface roughness in high-frequency region

Liew, E., Malaysia, M. C. F., Malaysia, S. A., Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H. & Kuwako, F., 2014 1 1.

研究成果: Paper

4 引用 (Scopus)

TE-TM Mode conversion optical isolator fabricated by wafer bonding

Yokoi, H., Mizumoto, T. & Iwasaki, H., 2003 12 1, p. 130-136. 7 p.

研究成果: Paper

1 引用 (Scopus)