材料工学科

研究成果

フィルター
Conference contribution
2020

Interferometric optical isolator with Si guiding layer operated in unidirectional magnetic field

Yokoi, H., Yumoto, A., Hasegawa, H. & Matsuzaki, S., 2020 4 1, 237th ECS Meeting: Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 10. Jagannathan, H., Kakushima, K., Timans, P. J., Gusev, E., Karim, Z., De Gendt, S., Misra, D., Obeng, Y. S. & Roo, F. (版). 3 版 Institute of Physics Publishing, p. 31-36 6 p. (ECS Transactions; 巻数 97, 番号 3).

研究成果: Conference contribution

Optical Communication and Positioning Method of Underwater Observation Apparatus for Environmental Monitor

Enomoto, E., Rajagopalan, U., Lee, S. Y., Zhang, X., Koike, Y., Yokoi, H., Nishikawa, H., Nagasawa, S., Futai, N., Kohno, T., Yamada, J., Shimojo, M. & Matsuo, S., 2020 1, 2020 10th Annual Computing and Communication Workshop and Conference, CCWC 2020. Chakrabarti, S. & Paul, R. (版). Institute of Electrical and Electronics Engineers Inc., p. 784-788 5 p. 9031130. (2020 10th Annual Computing and Communication Workshop and Conference, CCWC 2020).

研究成果: Conference contribution

2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Improved superconducting performance of Ag-added nano-diamond doped MgB 2

Dadiel, J. L., Miryala, M. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540I. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

Infiltration growth processing of bulk mixed REBa 2 Cu 3 O 7-x superconductors: Nano-metal oxides and rare earth elements effects on micro-structural properties

Pavan Kumar Naik, S., Nagaveni, K., Swarup Raju, P. M., Miryala, M., Koblischka, M. R., Koblischka-Veneva, A. D., Oka, T., Iwasa, Y., Ogino, H., Eisaki, H. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540H. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

1 引用 (Scopus)

International individual internship based on research collaboration on engineering education and academic science

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., Suzuki, T., Nishimura, S. Y. & Kaneko, F., 2019 1 29, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

研究成果: Conference contribution

2018

Ar-plasma-modulated optical reset in the SiO2/Cu conductive-bridge resistive memory stack

Kawashima, T., Yew, K. S., Zhou, Y., Ang, D. S., Zhang, H. Z. & Kyuno, K., 2018 1 1, ECS Transactions. Magyari-Kope, B., Bersuker, G., Kobayashi, K., Hacker, C., Park, J. G., Shingubara, S., Saito, Y., Karim, Z., Shima, H., Kubota, H. & Obeng, Y. S. (版). 3 版 Electrochemical Society Inc., 巻 86. p. 55-64 10 p.

研究成果: Conference contribution

2017

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

研究成果: Conference contribution

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution

2016

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

1 引用 (Scopus)

Study of measuring method for corrosion behavior analysis in low concentration solution

Yagi, Y., Suzuki, R. & Noda, K., 2016 1 1, Corrosion General Poster Session. 26 版 Electrochemical Society Inc., 巻 75. p. 7-15 9 p.

研究成果: Conference contribution

2015

Effect of MgB4 Addition on the Superconducting Properties of Polycrystalline MgB2

Ishiwata, J., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 69-72 4 p.

研究成果: Conference contribution

6 引用 (Scopus)

From Cyano-aromatic Molecules to Nitrogen-doped Carbons by Solution Plasma for the Oxygen Reduction Reaction in Alkaline Medium

Panomsuwan, G., Saito, N. & Ishizaki, T., 2015, Materials Today: Proceedings. 8 版 Elsevier Ltd, 巻 2. p. 4302-4308 7 p.

研究成果: Conference contribution

3 引用 (Scopus)

Improvement in the Performance of Bulk MgB2 Material through Optimization of Sintering Process

Kobayashi, H., Miryala, M., Koblischka, M. R., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 73-76 4 p.

研究成果: Conference contribution

2 引用 (Scopus)

Preparation and Characterization of DyBa2Cu3Oy Thick Films with Dy2BaO4 Precursor

Kawata, S., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 61-64 4 p.

研究成果: Conference contribution

1 引用 (Scopus)

Reconstruction method for phase-shifting electron holography fitted with fresnel diffraction affected fringes

Lei, D., Mitsuishi, K., Shimojo, M. & Takeguchi, M., 2015 1 1, Applied Materials and Technologies. Xiong, X. & Zhang, R. (版). Trans Tech Publications Ltd, p. 215-221 7 p. (Materials Science Forum; 巻数 833).

研究成果: Conference contribution

2013

Corrosion analysis of zinc rich epoxy coatings on steel in NaCl solution

Sofian, A. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2171-2176 6 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

1 引用 (Scopus)

Corrosion performance of zinc-rich paints (ZRP) on mild steel in NaCl solution

Sofian, A. H., Tanaka, A. & Noda, K., 2013 10 22, Corrosion (General) - 221st ECS Meeting. 19 版 p. 17-24 8 p. (ECS Transactions; 巻数 45, 番号 19).

研究成果: Conference contribution

Corrosion resistance enhancement of 304 stainless steel under droplet of chloride solution by mechanical surface treatment

Widodo, T. D. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2423-2429 7 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013 12 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1).

研究成果: Conference contribution

Localized corrosion resistance of Co-Cr alloy in NaCl solution

Suzuki, R., Noda, K., Tsutsumi, Y. & Hanawa, T., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2451-2454 4 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

Mapping of phase distribution in electron holography with a stage-scanning system

Lei, D., Mitsuishi, K., Harada, K., Shimojo, M., Ju, D. & Takeguchi, M., 2013, Advanced Materials Science and Technology. Trans Tech Publications Ltd, p. 152-155 4 p. (Materials Science Forum; 巻数 750).

研究成果: Conference contribution

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013 12 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1).

研究成果: Conference contribution

Quaternary alloy of Ni-Zn-Cu-P from hypophosphite based electroless deposition method

Zaimi, M. & Noda, K., 2013 10 22, Corrosion (General) - 221st ECS Meeting. 19 版 p. 3-16 14 p. (ECS Transactions; 巻数 45, 番号 19).

研究成果: Conference contribution

3 引用 (Scopus)
2012

Annealing effect on synthesis of VO 2 (M) nanopowders by a novel solution-based process

Chen, L. H., Huang, C. M., Zhou, J. H., Xu, G., Lei, M. & Xiao, X. D., 2012, Advanced Materials Research II. p. 725-729 5 p. (Advanced Materials Research; 巻数 463-464).

研究成果: Conference contribution

1 引用 (Scopus)

Wet chemical synthesis of Ni-Al nanoparticles at ambient condition

Fadil, N. A., Govindachetty, S., Yoshikawa, H., Yamashita, Y., Ueda, S., Kobayashi, K., Tanabe, T., Hara, T., Gubbala, V. R., Murakami, H., Noda, K. & Abe, H., 2012 10 15, Advanced Materials and Processes II. p. 442-447 6 p. (Advanced Materials Research; 巻数 557-559).

研究成果: Conference contribution

2011

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 713-718 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 2).

研究成果: Conference contribution

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 707-712 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 2).

研究成果: Conference contribution

1 引用 (Scopus)
2010

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010 8 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

研究成果: Conference contribution

7 引用 (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010 8 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

研究成果: Conference contribution

1 引用 (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010 6 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 755-759 5 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; 巻数 1).

研究成果: Conference contribution

1 引用 (Scopus)
2009

Impact of Si-doping on the Eu2+ luminescence in AlN:Eu phosphors

Dierrea, B., Yuan, X. L., Inoue, K., Hirosaki, N., Takeda, T., Xie, R. J. & Sekiguchi, T., 2009 11 25, Technical Digest - 2009 22nd International Vacuum Nanoelectronics Conference, IVNC 2009. p. 61-62 2 p. 5271842. (Technical Digest - 2009 22nd International Vacuum Nanoelectronics Conference, IVNC 2009).

研究成果: Conference contribution

Nanoscale pinning media in bulk melt-textured high-tc superconductors and their importance for super-magnet applications

Muralidhar, M., Sakai, N., Jirsa, M., Murakami, M. & Hirabayashi, I., 2009 3 27, Nanostructured Materials and Nanotechnology II - A Collection of Papers Presented at the 32nd International Conference on Advanced Ceramics and Composites. 8 版 p. 159-167 9 p. (Ceramic Engineering and Science Proceedings; 巻数 29, 番号 8).

研究成果: Conference contribution

The improvement of shape recovery property through training treatment in an Fe-30Mn-5Si-1Al

Koyama, M., Sawaguchi, T., Ogawa, K., Kikuchi, T. & Murakami, M., 2009 12 1, Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08. p. 583-586 4 p. (Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08).

研究成果: Conference contribution

1 引用 (Scopus)
2008

Corrosion behavior of Al-Al3Ni and Al-Al2Cu functionally graded materials fabricated by a centrifugal method

Noda, K., Miyahara, K. & Watanabe, Y., 2008 3 13, Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. p. 574-578 5 p. (AIP Conference Proceedings; 巻数 973).

研究成果: Conference contribution

1 引用 (Scopus)

Corrosion behavior of type 304 and 316 stainless steels under stress loading environment

Suzuki, K. & Noda, K., 2008 12 1, ECS Transactions - Corrosion Posters (General) - 214th ECS Meeting/PRiME 2008. 48 版 p. 15-21 7 p. (ECS Transactions; 巻数 16, 番号 48).

研究成果: Conference contribution

Corrosion resistance evaluation of a functionally graded material using an electrochemical sensor

Saitoh, T., Kakefuda, K., Noda, K. & Watanabe, Y., 2008 3 13, Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. p. 965-970 6 p. (AIP Conference Proceedings; 巻数 973).

研究成果: Conference contribution

Degradation of solid polymer membrane in PEFC by hydrogen peroxide

Kato, S., Masahira, Y., Noda, K. & Imai, H., 2008 12 1, ECS Transactions - Corrosion Posters (General) - 214th ECS Meeting/PRiME 2008. 48 版 p. 1-5 5 p. (ECS Transactions; 巻数 16, 番号 48).

研究成果: Conference contribution

3 引用 (Scopus)

End corrosion of galvanized steels under atmospheric corrosion environment

Sekita, K., Hirano, T. & Noda, K., 2008 12 1, ECS Transactions - Corrosion Posters (General) - 214th ECS Meeting/PRiME 2008. 48 版 p. 7-13 7 p. (ECS Transactions; 巻数 16, 番号 48).

研究成果: Conference contribution

Influence of al concentration on deformation behavior and fracture mode of fe-30mn-6(SI, AL) alloys

Ogawa, K., Sawaguchi, T., Kikuchi, T., Koyama, M. & Murakami, M., 2008 12 1, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 645-652 8 p. (SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies).

研究成果: Conference contribution

2 引用 (Scopus)

Localized corrosion behavior of austenitic stainless steels under stress loading environment

Noda, K. & Suzuki, K., 2008 12 1, ECS Transactions - Critical Factors in Localized Corrosion 6, in Honor of Professor Shibata - 214th ECS Meeting. 52 版 p. 239-246 8 p. (ECS Transactions; 巻数 16, 番号 52).

研究成果: Conference contribution

Quenching characteristics of YBCO bulk contacts

Sawa, K., Fukuda, K., Ogawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2008 12 1, 2008 Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, HOLM 2008. p. 319-324 6 p. 4694963. (Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts).

研究成果: Conference contribution

Shape memory characteristics of Fe-30Mn-5Si-1Al and Fe28Mn-5Si-1 AI-5Cr alloys

Koyama, M., Murakami, M., Ogawa, K., Kikuchi, T. & Sawaguchi, S., 2008 12 1, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 653-658 6 p. (SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies).

研究成果: Conference contribution

2007

A study on quenching characteristics of YBaCuO bulk superconductor with deposited Ag layer

Fukuda, K., Fujita, H., Sawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2007 12 1, Electrical Contacts 2007: Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts. p. 76-81 6 p. 4318198. (Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts).

研究成果: Conference contribution

Calcium phosphate precipitation by galvanic current between titanium and gold in pseudo-body fluid

Kobayashi, E., Ogo, M., Doi, H., Yoneyama, T., Noda, K. & Hanawa, T., 2007 12 1, Supplement to THERMEC 2006, 5th International Conference on PROCESSING and MANUFACTURING OF ADVANCED MATERIALS, THERMEC 2006. PART 1 版 p. 653-656 4 p. (Materials Science Forum; 巻数 539-543, 番号 PART 1).

研究成果: Conference contribution