研究成果 1983 2019

フィルター
Conference contribution
2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Creep
Nanoparticles
Power semiconductor devices

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Metallic compounds
Cracks
Direction compound
Power semiconductor devices

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles

Improved superconducting performance of Ag-added nano-diamond doped MgB 2

Dadiel, J. L., Miryala, M. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540I. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

Nanodiamonds
Diamond
Diamonds
diamonds
Chemical analysis

Infiltration growth processing of bulk mixed REBa 2 Cu 3 O 7-x superconductors: Nano-metal oxides and rare earth elements effects on micro-structural properties

Pavan Kumar Naik, S., Nagaveni, K., Swarup Raju, P. M., Miryala, M., Koblischka, M. R., Koblischka-Veneva, A. D., Oka, T., Iwasa, Y., Ogino, H., Eisaki, H. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540H. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

infiltration
Rare earth elements
Infiltration
Oxides
Superconducting materials

International individual internship based on research collaboration on engineering education and academic science

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., Suzuki, T., Nishimura, S. Y. & Kaneko, F., 2019 1 29, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

研究成果: Conference contribution

internship
Engineering education
Students
engineering
science
2018

Ar-plasma-modulated optical reset in the SiO2/Cu conductive-bridge resistive memory stack

Kawashima, T., Yew, K. S., Zhou, Y., Ang, D. S., Zhang, H. Z. & Kyuno, K., 2018 1 1, ECS Transactions. Magyari-Kope, B., Bersuker, G., Kobayashi, K., Hacker, C., Park, J. G., Shingubara, S., Saito, Y., Karim, Z., Shima, H., Kubota, H. & Obeng, Y. S. (版). 3 版 Electrochemical Society Inc., 巻 86. p. 55-64 10 p.

研究成果: Conference contribution

Plasmas
Data storage equipment
Oxides
Surface defects
Ions
1 引用 (Scopus)

Dry progressive stamping of copper-alloy snaps by the plasma nitrided punches

Aizawa, T. & Morita, H., 2018 1 1, Technology of Plasticity. Trans Tech Publications Ltd, p. 28-33 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

stamping
punches
copper alloys
Stamping
Copper alloys

Plasma printing of micro-punch assembly for micro-embossing of aluminum sheets

Aizawa, T., Wasa, K., Farghali, A. & Tamagaki, H., 2018 1 1, Technology of Plasticity. Trans Tech Publications Ltd, p. 161-166 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

embossing
Aluminum sheet
punches
Stamping
Steel
2017

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

研究成果: Conference contribution

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

研究成果: Conference contribution

Fatigue crack propagation
Nanoparticles
Thermal effects
Temperature
2016
1 引用 (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

Power converters
Thermal cycling
Semiconductor materials
Binary alloys
Fatigue of materials

Study of measuring method for corrosion behavior analysis in low concentration solution

Yagi, Y., Suzuki, R. & Noda, K., 2016 1 1, Corrosion General Poster Session. 26 版 Electrochemical Society Inc., 巻 75. p. 7-15 9 p.

研究成果: Conference contribution

Corrosion
Cathodic protection
Corrosion protection
Stainless steel
Electrolytes
2015
5 引用 (Scopus)

Effect of MgB4 Addition on the Superconducting Properties of Polycrystalline MgB2

Ishiwata, J., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 69-72 4 p.

研究成果: Conference contribution

critical current
current density
flux pinning
dispersing
leaching
2 引用 (Scopus)

From Cyano-aromatic Molecules to Nitrogen-doped Carbons by Solution Plasma for the Oxygen Reduction Reaction in Alkaline Medium

Panomsuwan, G., Saito, N. & Ishizaki, T., 2015, Materials Today: Proceedings. 8 版 Elsevier Ltd, 巻 2. p. 4302-4308 7 p.

研究成果: Conference contribution

Nitrogen
Carbon
Oxygen
Plasmas
Molecules
2 引用 (Scopus)

Improvement in the Performance of Bulk MgB2 Material through Optimization of Sintering Process

Kobayashi, H., Miryala, M., Koblischka, M. R., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 73-76 4 p.

研究成果: Conference contribution

sintering
optimization
disks (shapes)
critical current
grain size

Plasma-nitriding assisted micro-texturing into stainless steel molds

Aizawa, T., Suga, H. & Yamaguchi, T., 2015 8 10, MATEC Web of Conferences. EDP Sciences, 巻 21. 09002

研究成果: Conference contribution

Texturing
Nitriding
Stainless Steel
Molds
Stainless steel
1 引用 (Scopus)

Preparation and Characterization of DyBa2Cu3Oy Thick Films with Dy2BaO4 Precursor

Kawata, S., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 61-64 4 p.

研究成果: Conference contribution

thick films
preparation
printing
acetates
magnetization

Reconstruction method for phase-shifting electron holography fitted with fresnel diffraction affected fringes

Lei, D., Mitsuishi, K., Shimojo, M. & Takeguchi, M., 2015, Applied Materials and Technologies. Trans Tech Publications Ltd, 巻 833. p. 215-221 7 p. (Materials Science Forum; 巻数 833).

研究成果: Conference contribution

Electron holography
Fresnel diffraction
Holograms
holography
Diffraction

Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding

Aizawa, T., Fukuda, T. & Morita, H., 2015 8 10, MATEC Web of Conferences. EDP Sciences, 巻 21. 08002

研究成果: Conference contribution

Plasma density
Stamping
Nitriding
Stainless Steel
Molds
2014
4 引用 (Scopus)

Large area micro-texture imprinting onto metallic sheet via CNC stamping

Aizawa, T., Tamaki, M. & Fukuda, T., 2014, 11th International Conference on Technology of Plasticity, ICTP 2014. Elsevier Ltd, 巻 81. p. 1427-1432 6 p.

研究成果: Conference contribution

Stamping
Aspect ratio
Aluminum sheet
Textures
Motion control

Motion-controlled precise stamping for microtexturing onto aluminum sheet

Aizawa, T., Itoh, T., Tamaki, M. & Fukuda, T., 2014, Key Engineering Materials. Trans Tech Publications Ltd, 巻 622-623. p. 64-71 8 p. (Key Engineering Materials; 巻数 622-623).

研究成果: Conference contribution

Aluminum sheet
Stamping
Texturing
Motion control
Metals
2013

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013, ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 6756126

研究成果: Conference contribution

Polyimides
Finite element method
1 引用 (Scopus)

Corrosion analysis of zinc rich epoxy coatings on steel in NaCl solution

Sofian, A. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2171-2176 6 p.

研究成果: Conference contribution

Steel
Zinc
Paint
Corrosion
Coatings

Corrosion performance of zinc-rich paints (ZRP) on mild steel in NaCl solution

Sofian, A. H., Tanaka, A. & Noda, K., 2013, ECS Transactions. 19 版 巻 45. p. 17-24 8 p.

研究成果: Conference contribution

Paint
Carbon steel
Zinc
Corrosion
Coatings
3 引用 (Scopus)

Corrosion resistance and mechanism of zinc rich paint in corrosive media

Sofian, A. H. & Noda, K., 2013, ECS Transactions. 38 版 Electrochemical Society Inc., 巻 58. p. 29-37 9 p.

研究成果: Conference contribution

Paint
Corrosion resistance
Zinc
Electrochemical impedance spectroscopy
Coatings

Corrosion resistance enhancement of 304 stainless steel under droplet of chloride solution by mechanical surface treatment

Widodo, T. D. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2423-2429 7 p.

研究成果: Conference contribution

Stainless Steel
Surface potential
Corrosion resistance
Surface treatment
Chlorides

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Eutectics
Strain rate
Fatigue of materials
Temperature
Ductility

Localized corrosion resistance of Co-Cr alloy in NaCl solution

Suzuki, R., Noda, K., Tsutsumi, Y. & Hanawa, T., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2451-2454 4 p.

研究成果: Conference contribution

Corrosion resistance
Stainless Steel
Stainless steel
Polarization
Corrosion

Mapping of phase distribution in electron holography with a stage-scanning system

Lei, D., Mitsuishi, K., Harada, K., Shimojo, M., Ju, D. & Takeguchi, M., 2013, Materials Science Forum. 巻 750. p. 152-155 4 p. (Materials Science Forum; 巻数 750).

研究成果: Conference contribution

Electron holography
Holograms
holography
Electron optics
Scanning

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
9 引用 (Scopus)

Micro-texturing onto amorphous carbon materials as a mold-die for micro-forming

Aizawa, T., 2013, Applied Mechanics and Materials. 巻 289. p. 23-37 15 p. (Applied Mechanics and Materials; 巻数 289).

研究成果: Conference contribution

Texturing
Amorphous carbon
Stamping
Glassy carbon
Carbon
3 引用 (Scopus)

Quaternary alloy of Ni-Zn-Cu-P from hypophosphite based electroless deposition method

Zaimi, M. & Noda, K., 2013, ECS Transactions. 19 版 巻 45. p. 3-16 14 p.

研究成果: Conference contribution

Electroless plating
Plating
Zinc
Polarization
Corrosion

Surface potential distribution observation of the surface modified of 304 stainless steel

Widodo, T. D. & Noda, K., 2013, ECS Transactions. 38 版 Electrochemical Society Inc., 巻 58. p. 53-59 7 p.

研究成果: Conference contribution

Surface potential
Surface treatment
Stainless steel
Microscopes
Electrolytes
2012

Duplex coating of AISI 316 and 420 die for hot mold stamping

Aizawa, T., Fukuda, T. & Itoh, K., 2012, Steel Research International. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 1055-1058 4 p.

研究成果: Conference contribution

stamping
Stamping
Nitriding
Oxides
Hardness testing
3 引用 (Scopus)

Micro-pattern imprinting onto aluminum thin sheet by CNC-controlled stamping

Aizawa, T. & Fukuda, T., 2012, Steel Research International. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 739-742 4 p.

研究成果: Conference contribution

stamping
Stamping
Aluminum
Aluminum sheet
grooving
1 引用 (Scopus)

Pitting corrosion behavior and grain evolution of shot peened type 304 stainless steel

Widodo, T. D. & Noda, K., 2012, ECS Transactions. 37 版 巻 50. p. 273-277 5 p.

研究成果: Conference contribution

Pitting
Stainless steel
Shot peening
Corrosion
Electrodes

Wet chemical synthesis of Ni-Al nanoparticles at ambient condition

Fadil, N. A., Govindachetty, S., Yoshikawa, H., Yamashita, Y., Ueda, S., Kobayashi, K., Tanabe, T., Hara, T., Gubbala, V. R., Murakami, H., Noda, K. & Abe, H., 2012, Advanced Materials Research. 巻 557-559. p. 442-447 6 p. (Advanced Materials Research; 巻数 557-559).

研究成果: Conference contribution

Organometallics
Photoelectron spectroscopy
Nanoparticles
X ray spectroscopy
Intermetallics
2011
2 引用 (Scopus)

Development of precise micro press forming system for fabrication of micro parts

Yang, M., Aizawa, T., Nakano, S. & Ito, K., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1093-1096 4 p.

研究成果: Conference contribution

Fabrication
Forging
Metal forming
Joining
Metal foil
6 引用 (Scopus)

Dry transfer stamping by nano-laminated DLC-coated tool

Morita, H., Aizawa, T., Yoshida, N. & Kurozumi, S., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1103-1108 6 p.

研究成果: Conference contribution

Diamond
Stamping
Diamonds
Carbon
Coatings

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 713-718 6 p.

研究成果: Conference contribution

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys
1 引用 (Scopus)

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 707-712 6 p.

研究成果: Conference contribution

Soldering alloys
Fatigue of materials
Crack initiation
Grain boundaries
Strain hardening
4 引用 (Scopus)

Fine micro-stamping system for micro-pattern printing onto polymers and glasses

Aizawa, T., Itoh, K. & Fukuda, T., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1097-1102 6 p.

研究成果: Conference contribution

Stamping
Printing
Polymers
Glass
Displacement control

Optimal chain length of peg to improve cytocompatibility of rgd/peg/ti material

Hanawa, T., Kurashima, K., Oya, K., Yusuketsustumi, A., Doi, H., Nomura, N. & Noda, K., 2011, 24th European Conference on Biomaterials - Annual Conference of the European Society for Biomaterials.

研究成果: Conference contribution

Chain length
2010
7 引用 (Scopus)

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298

研究成果: Conference contribution

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation
1 引用 (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291

研究成果: Conference contribution

Thermal fatigue
Fatigue testing
Mechanical testing
Fatigue of materials
Coarsening
1 引用 (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻 1. p. 755-759 5 p.

研究成果: Conference contribution

Reliability analysis
Fatigue of materials
Finite element method
Viscoelasticity
Thermal cycling