研究成果

フィルター
Conference contribution
2020

Interferometric optical isolator with Si guiding layer operated in unidirectional magnetic field

Yokoi, H., Yumoto, A., Hasegawa, H. & Matsuzaki, S., 2020 4 1, 237th ECS Meeting: Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 10. Jagannathan, H., Kakushima, K., Timans, P. J., Gusev, E., Karim, Z., De Gendt, S., Misra, D., Obeng, Y. S. & Roo, F. (版). 3 版 Institute of Physics Publishing, p. 31-36 6 p. (ECS Transactions; 巻数 97, 番号 3).

研究成果: Conference contribution

Optical Communication and Positioning Method of Underwater Observation Apparatus for Environmental Monitor

Enomoto, E., Rajagopalan, U., Lee, S. Y., Zhang, X., Koike, Y., Yokoi, H., Nishikawa, H., Nagasawa, S., Futai, N., Kohno, T., Yamada, J., Shimojo, M. & Matsuo, S., 2020 1, 2020 10th Annual Computing and Communication Workshop and Conference, CCWC 2020. Chakrabarti, S. & Paul, R. (版). Institute of Electrical and Electronics Engineers Inc., p. 784-788 5 p. 9031130. (2020 10th Annual Computing and Communication Workshop and Conference, CCWC 2020).

研究成果: Conference contribution

2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Improved superconducting performance of Ag-added nano-diamond doped MgB 2

Dadiel, J. L., Miryala, M. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540I. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

Infiltration growth processing of bulk mixed REBa 2 Cu 3 O 7-x superconductors: Nano-metal oxides and rare earth elements effects on micro-structural properties

Pavan Kumar Naik, S., Nagaveni, K., Swarup Raju, P. M., Miryala, M., Koblischka, M. R., Koblischka-Veneva, A. D., Oka, T., Iwasa, Y., Ogino, H., Eisaki, H. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540H. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

1 引用 (Scopus)

International individual internship based on research collaboration on engineering education and academic science

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., Suzuki, T., Nishimura, S. Y. & Kaneko, F., 2019 1 29, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

研究成果: Conference contribution

2018

Ar-plasma-modulated optical reset in the SiO2/Cu conductive-bridge resistive memory stack

Kawashima, T., Yew, K. S., Zhou, Y., Ang, D. S., Zhang, H. Z. & Kyuno, K., 2018 1 1, ECS Transactions. Magyari-Kope, B., Bersuker, G., Kobayashi, K., Hacker, C., Park, J. G., Shingubara, S., Saito, Y., Karim, Z., Shima, H., Kubota, H. & Obeng, Y. S. (版). 3 版 Electrochemical Society Inc., 巻 86. p. 55-64 10 p.

研究成果: Conference contribution

Dry progressive stamping of copper-alloy snaps by the plasma nitrided punches

Aizawa, T. & Morita, H., 2018 1 1, Technology of Plasticity. Wang, G-J., Fann, K-J., Hwang, Y-M. & Jiang, C-P. (版). Trans Tech Publications Ltd, p. 28-33 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

1 引用 (Scopus)

Plasma printing of micro-punch assembly for micro-embossing of aluminum sheets

Aizawa, T., Wasa, K., Farghali, A. & Tamagaki, H., 2018 1 1, Technology of Plasticity. Wang, G-J., Fann, K-J., Hwang, Y-M. & Jiang, C-P. (版). Trans Tech Publications Ltd, p. 161-166 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

2017

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

研究成果: Conference contribution

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution

2016

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

1 引用 (Scopus)

Study of measuring method for corrosion behavior analysis in low concentration solution

Yagi, Y., Suzuki, R. & Noda, K., 2016 1 1, Corrosion General Poster Session. 26 版 Electrochemical Society Inc., 巻 75. p. 7-15 9 p.

研究成果: Conference contribution

2015

Effect of MgB4 Addition on the Superconducting Properties of Polycrystalline MgB2

Ishiwata, J., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 69-72 4 p.

研究成果: Conference contribution

6 引用 (Scopus)

From Cyano-aromatic Molecules to Nitrogen-doped Carbons by Solution Plasma for the Oxygen Reduction Reaction in Alkaline Medium

Panomsuwan, G., Saito, N. & Ishizaki, T., 2015, Materials Today: Proceedings. 8 版 Elsevier Ltd, 巻 2. p. 4302-4308 7 p.

研究成果: Conference contribution

3 引用 (Scopus)

Improvement in the Performance of Bulk MgB2 Material through Optimization of Sintering Process

Kobayashi, H., Miryala, M., Koblischka, M. R., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 73-76 4 p.

研究成果: Conference contribution

2 引用 (Scopus)

Plasma-nitriding assisted micro-texturing into stainless steel molds

Aizawa, T., Suga, H. & Yamaguchi, T., 2015 8 10, 4th International Conference on New Forming Technology, ICNFT 2015. Yuan, S. J., Lin, J., Qin, Y., Dean, T. A. & Vollertsen, F. (版). EDP Sciences, 09002. (MATEC Web of Conferences; 巻数 21).

研究成果: Conference contribution

Preparation and Characterization of DyBa2Cu3Oy Thick Films with Dy2BaO4 Precursor

Kawata, S., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 61-64 4 p.

研究成果: Conference contribution

1 引用 (Scopus)

Reconstruction method for phase-shifting electron holography fitted with fresnel diffraction affected fringes

Lei, D., Mitsuishi, K., Shimojo, M. & Takeguchi, M., 2015 1 1, Applied Materials and Technologies. Xiong, X. & Zhang, R. (版). Trans Tech Publications Ltd, p. 215-221 7 p. (Materials Science Forum; 巻数 833).

研究成果: Conference contribution

Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding

Aizawa, T., Fukuda, T. & Morita, H., 2015 8 10, 4th International Conference on New Forming Technology, ICNFT 2015. Yuan, S. J., Lin, J., Qin, Y., Dean, T. A. & Vollertsen, F. (版). EDP Sciences, 08002. (MATEC Web of Conferences; 巻数 21).

研究成果: Conference contribution

2014

Large area micro-texture imprinting onto metallic sheet via CNC stamping

Aizawa, T., Tamaki, M. & Fukuda, T., 2014, 11th International Conference on Technology of Plasticity, ICTP 2014. Elsevier Ltd, 巻 81. p. 1427-1432 6 p.

研究成果: Conference contribution

5 引用 (Scopus)

Motion-controlled precise stamping for microtexturing onto aluminum sheet

Aizawa, T., Itoh, T., Tamaki, M. & Fukuda, T., 2014 1 1, Metal Forming 2014. Micari, F. & Fratini, L. (版). Trans Tech Publications Ltd, p. 64-71 8 p. (Key Engineering Materials; 巻数 622-623).

研究成果: Conference contribution

2013

Corrosion analysis of zinc rich epoxy coatings on steel in NaCl solution

Sofian, A. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2171-2176 6 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

1 引用 (Scopus)

Corrosion performance of zinc-rich paints (ZRP) on mild steel in NaCl solution

Sofian, A. H., Tanaka, A. & Noda, K., 2013 10 22, Corrosion (General) - 221st ECS Meeting. 19 版 p. 17-24 8 p. (ECS Transactions; 巻数 45, 番号 19).

研究成果: Conference contribution

Corrosion resistance enhancement of 304 stainless steel under droplet of chloride solution by mechanical surface treatment

Widodo, T. D. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2423-2429 7 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013 12 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1).

研究成果: Conference contribution

Localized corrosion resistance of Co-Cr alloy in NaCl solution

Suzuki, R., Noda, K., Tsutsumi, Y. & Hanawa, T., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., p. 2451-2454 4 p. (8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8; 巻数 3).

研究成果: Conference contribution

Mapping of phase distribution in electron holography with a stage-scanning system

Lei, D., Mitsuishi, K., Harada, K., Shimojo, M., Ju, D. & Takeguchi, M., 2013, Advanced Materials Science and Technology. Trans Tech Publications Ltd, p. 152-155 4 p. (Materials Science Forum; 巻数 750).

研究成果: Conference contribution

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013 12 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1).

研究成果: Conference contribution

Micro-texturing onto amorphous carbon materials as a mold-die for micro-forming

Aizawa, T., 2013 3 11, Micro Manufacturing Techniques and Applications. p. 23-37 15 p. (Applied Mechanics and Materials; 巻数 289).

研究成果: Conference contribution

9 引用 (Scopus)

Quaternary alloy of Ni-Zn-Cu-P from hypophosphite based electroless deposition method

Zaimi, M. & Noda, K., 2013 10 22, Corrosion (General) - 221st ECS Meeting. 19 版 p. 3-16 14 p. (ECS Transactions; 巻数 45, 番号 19).

研究成果: Conference contribution

3 引用 (Scopus)
2012

Duplex coating of AISI 316 and 420 die for hot mold stamping

Aizawa, T., Fukuda, T. & Itoh, K., 2012 1 1, Proceedings of the 14th International Conference on Metal Forming, METAL FORMING 2012. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 1055-1058 4 p.

研究成果: Conference contribution

Micro-pattern imprinting onto aluminum thin sheet by CNC-controlled stamping

Aizawa, T. & Fukuda, T., 2012 1 1, Proceedings of the 14th International Conference on Metal Forming, METAL FORMING 2012. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 739-742 4 p.

研究成果: Conference contribution

3 引用 (Scopus)

Wet chemical synthesis of Ni-Al nanoparticles at ambient condition

Fadil, N. A., Govindachetty, S., Yoshikawa, H., Yamashita, Y., Ueda, S., Kobayashi, K., Tanabe, T., Hara, T., Gubbala, V. R., Murakami, H., Noda, K. & Abe, H., 2012 10 15, Advanced Materials and Processes II. p. 442-447 6 p. (Advanced Materials Research; 巻数 557-559).

研究成果: Conference contribution

2011

Development of precise micro press forming system for fabrication of micro parts

Yang, M., Aizawa, T., Nakano, S. & Ito, K., 2011 12 1, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1093-1096 4 p. (Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011).

研究成果: Conference contribution

2 引用 (Scopus)

Dry transfer stamping by nano-laminated DLC-coated tool

Morita, H., Aizawa, T., Yoshida, N. & Kurozumi, S., 2011 12 1, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1103-1108 6 p. (Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011).

研究成果: Conference contribution

7 引用 (Scopus)

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 713-718 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 2).

研究成果: Conference contribution

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011 12 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 707-712 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 2).

研究成果: Conference contribution

1 引用 (Scopus)

Fine micro-stamping system for micro-pattern printing onto polymers and glasses

Aizawa, T., Itoh, K. & Fukuda, T., 2011 12 1, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1097-1102 6 p. (Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011).

研究成果: Conference contribution

4 引用 (Scopus)
2010

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010 8 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

研究成果: Conference contribution

7 引用 (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010 8 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

研究成果: Conference contribution

1 引用 (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010 6 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 755-759 5 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; 巻数 1).

研究成果: Conference contribution

1 引用 (Scopus)
2009

Nanoscale pinning media in bulk melt-textured high-tc superconductors and their importance for super-magnet applications

Muralidhar, M., Sakai, N., Jirsa, M., Murakami, M. & Hirabayashi, I., 2009 3 27, Nanostructured Materials and Nanotechnology II - A Collection of Papers Presented at the 32nd International Conference on Advanced Ceramics and Composites. 8 版 p. 159-167 9 p. (Ceramic Engineering and Science Proceedings; 巻数 29, 番号 8).

研究成果: Conference contribution

The improvement of shape recovery property through training treatment in an Fe-30Mn-5Si-1Al

Koyama, M., Sawaguchi, T., Ogawa, K., Kikuchi, T. & Murakami, M., 2009 12 1, Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08. p. 583-586 4 p. (Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08).

研究成果: Conference contribution

1 引用 (Scopus)
2008

Corrosion behavior of Al-Al3Ni and Al-Al2Cu functionally graded materials fabricated by a centrifugal method

Noda, K., Miyahara, K. & Watanabe, Y., 2008 3 13, Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. p. 574-578 5 p. (AIP Conference Proceedings; 巻数 973).

研究成果: Conference contribution

1 引用 (Scopus)