研究成果 1983 2019

フィルター
Conference contribution

Wet chemical synthesis of Ni-Al nanoparticles at ambient condition

Fadil, N. A., Govindachetty, S., Yoshikawa, H., Yamashita, Y., Ueda, S., Kobayashi, K., Tanabe, T., Hara, T., Gubbala, V. R., Murakami, H., Noda, K. & Abe, H., 2012, Advanced Materials Research. 巻 557-559. p. 442-447 6 p. (Advanced Materials Research; 巻数 557-559).

研究成果: Conference contribution

Organometallics
Photoelectron spectroscopy
Nanoparticles
X ray spectroscopy
Intermetallics
1 引用 (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻 1. p. 755-759 5 p.

研究成果: Conference contribution

Reliability analysis
Fatigue of materials
Finite element method
Viscoelasticity
Thermal cycling
1 引用 (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291

研究成果: Conference contribution

Thermal fatigue
Fatigue testing
Mechanical testing
Fatigue of materials
Coarsening
3 引用 (Scopus)

Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 1 1, Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Institute of Electrical and Electronics Engineers Inc., p. 626-631 6 p. 747688

研究成果: Conference contribution

Thermal fatigue
Fatigue damage
Soldering alloys
Fatigue of materials
Bismuth
1 引用 (Scopus)

The improvement of shape recovery property through training treatment in an Fe-30Mn-5Si-1Al

Koyama, M., Sawaguchi, T., Ogawa, K., Kikuchi, T. & Murakami, M., 2009, Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08. p. 583-586 4 p.

研究成果: Conference contribution

Recovery
Twinning
Martensitic transformations
Stress-strain curves
Shape memory effect

The force relaxation in levitating high Tc superconductor

Ito, E., Komano, Y., Sawa, K., Murakami, M., Sakai, N. & Hirabayashi, I., 2006 3 31, AIP Conference Proceedings. 巻 824 II. p. 820-827 8 p.

研究成果: Conference contribution

levitation
descent
flywheels
electromagnets
power loss

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

研究成果: Conference contribution

Fatigue crack propagation
Nanoparticles
Thermal effects
Temperature

Surface potential distribution observation of the surface modified of 304 stainless steel

Widodo, T. D. & Noda, K., 2013, ECS Transactions. 38 版 Electrochemical Society Inc., 巻 58. p. 53-59 7 p.

研究成果: Conference contribution

Surface potential
Surface treatment
Stainless steel
Microscopes
Electrolytes

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

研究成果: Conference contribution

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films

Study of measuring method for corrosion behavior analysis in low concentration solution

Yagi, Y., Suzuki, R. & Noda, K., 2016 1 1, Corrosion General Poster Session. 26 版 Electrochemical Society Inc., 巻 75. p. 7-15 9 p.

研究成果: Conference contribution

Corrosion
Cathodic protection
Corrosion protection
Stainless steel
Electrolytes

Structural materialization of stainless steel molds and dies by the low temperature high density plasma nitriding

Aizawa, T., Fukuda, T. & Morita, H., 2015 8 10, MATEC Web of Conferences. EDP Sciences, 巻 21. 08002

研究成果: Conference contribution

Plasma density
Stamping
Nitriding
Stainless Steel
Molds

Shape memory characteristics of Fe-30Mn-5Si-1Al and Fe28Mn-5Si-1 AI-5Cr alloys

Koyama, M., Murakami, M., Ogawa, K., Kikuchi, T. & Sawaguchi, S., 2008, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 653-658 6 p.

研究成果: Conference contribution

Shape memory effect
Recovery
Ductility
Tensile strain
Martensite

Reconstruction method for phase-shifting electron holography fitted with fresnel diffraction affected fringes

Lei, D., Mitsuishi, K., Shimojo, M. & Takeguchi, M., 2015, Applied Materials and Technologies. Trans Tech Publications Ltd, 巻 833. p. 215-221 7 p. (Materials Science Forum; 巻数 833).

研究成果: Conference contribution

Electron holography
Fresnel diffraction
Holograms
holography
Diffraction

Quenching characteristics of YBCO bulk contacts

Sawa, K., Fukuda, K., Ogawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2008, Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts. p. 319-324 6 p. 4694963

研究成果: Conference contribution

Quenching
Switches
Silver
Contact resistance
Polishing
3 引用 (Scopus)

Quaternary alloy of Ni-Zn-Cu-P from hypophosphite based electroless deposition method

Zaimi, M. & Noda, K., 2013, ECS Transactions. 19 版 巻 45. p. 3-16 14 p.

研究成果: Conference contribution

Electroless plating
Plating
Zinc
Polarization
Corrosion
2 引用 (Scopus)

Preparation of mono-dispersed droplet using ultrasonic

Arai, T., Imaizumi, K. & Takeda, K., 2000, Proceedings of the Second International Conference on Processing Materials for Properties. Mishra, B., Yamauchi, C., Mishra, B. & Yamauchi, C. (版). p. 989-992 4 p.

研究成果: Conference contribution

Ultrasonics
Liquids
Electric distortion
Stroboscopes
Acoustic generators
1 引用 (Scopus)

Preparation and Characterization of DyBa2Cu3Oy Thick Films with Dy2BaO4 Precursor

Kawata, S., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 61-64 4 p.

研究成果: Conference contribution

thick films
preparation
printing
acetates
magnetization

Plasma printing of micro-punch assembly for micro-embossing of aluminum sheets

Aizawa, T., Wasa, K., Farghali, A. & Tamagaki, H., 2018 1 1, Technology of Plasticity. Trans Tech Publications Ltd, p. 161-166 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

embossing
Aluminum sheet
punches
Stamping
Steel

Plasma-nitriding assisted micro-texturing into stainless steel molds

Aizawa, T., Suga, H. & Yamaguchi, T., 2015 8 10, MATEC Web of Conferences. EDP Sciences, 巻 21. 09002

研究成果: Conference contribution

Texturing
Nitriding
Stainless Steel
Molds
Stainless steel
1 引用 (Scopus)

Pitting corrosion behavior and grain evolution of shot peened type 304 stainless steel

Widodo, T. D. & Noda, K., 2012, ECS Transactions. 37 版 巻 50. p. 273-277 5 p.

研究成果: Conference contribution

Pitting
Stainless steel
Shot peening
Corrosion
Electrodes

Optimal chain length of peg to improve cytocompatibility of rgd/peg/ti material

Hanawa, T., Kurashima, K., Oya, K., Yusuketsustumi, A., Doi, H., Nomura, N. & Noda, K., 2011, 24th European Conference on Biomaterials - Annual Conference of the European Society for Biomaterials.

研究成果: Conference contribution

Chain length

Nanoscale pinning media in bulk melt-textured high-tc superconductors and their importance for super-magnet applications

Miryala, M., Sakai, N., Jirsa, M., Murakami, M. & Hirabayashi, I., 2009, Ceramic Engineering and Science Proceedings. 8 版 巻 29. p. 159-167 9 p.

研究成果: Conference contribution

Superconducting materials
Magnets
Argon
Wind power
Rare earths

Motion-controlled precise stamping for microtexturing onto aluminum sheet

Aizawa, T., Itoh, T., Tamaki, M. & Fukuda, T., 2014, Key Engineering Materials. Trans Tech Publications Ltd, 巻 622-623. p. 64-71 8 p. (Key Engineering Materials; 巻数 622-623).

研究成果: Conference contribution

Aluminum sheet
Stamping
Texturing
Motion control
Metals
9 引用 (Scopus)

Micro-texturing onto amorphous carbon materials as a mold-die for micro-forming

Aizawa, T., 2013, Applied Mechanics and Materials. 巻 289. p. 23-37 15 p. (Applied Mechanics and Materials; 巻数 289).

研究成果: Conference contribution

Texturing
Amorphous carbon
Stamping
Glassy carbon
Carbon

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
3 引用 (Scopus)

Micro-pattern imprinting onto aluminum thin sheet by CNC-controlled stamping

Aizawa, T. & Fukuda, T., 2012, Steel Research International. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 739-742 4 p.

研究成果: Conference contribution

stamping
Stamping
Aluminum
Aluminum sheet
grooving

Mapping of phase distribution in electron holography with a stage-scanning system

Lei, D., Mitsuishi, K., Harada, K., Shimojo, M., Ju, D. & Takeguchi, M., 2013, Materials Science Forum. 巻 750. p. 152-155 4 p. (Materials Science Forum; 巻数 750).

研究成果: Conference contribution

Electron holography
Holograms
holography
Electron optics
Scanning

Localized corrosion resistance of Co-Cr alloy in NaCl solution

Suzuki, R., Noda, K., Tsutsumi, Y. & Hanawa, T., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2451-2454 4 p.

研究成果: Conference contribution

Corrosion resistance
Stainless Steel
Stainless steel
Polarization
Corrosion

Localized corrosion behavior of austenitic stainless steels under stress loading environment

Noda, K. & Suzuki, K., 2008, ECS Transactions. 52 版 巻 16. p. 239-246 8 p.

研究成果: Conference contribution

Austenitic stainless steel
Corrosion
Stress corrosion cracking
Passivation
Stainless steel
4 引用 (Scopus)

Large area micro-texture imprinting onto metallic sheet via CNC stamping

Aizawa, T., Tamaki, M. & Fukuda, T., 2014, 11th International Conference on Technology of Plasticity, ICTP 2014. Elsevier Ltd, 巻 81. p. 1427-1432 6 p.

研究成果: Conference contribution

Stamping
Aspect ratio
Aluminum sheet
Textures
Motion control

International individual internship based on research collaboration on engineering education and academic science

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., Suzuki, T., Nishimura, S. Y. & Kaneko, F., 2019 1 29, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

研究成果: Conference contribution

internship
Engineering education
Students
engineering
science
2 引用 (Scopus)

Influence of al concentration on deformation behavior and fracture mode of fe-30mn-6(SI, AL) alloys

Ogawa, K., Sawaguchi, T., Kikuchi, T., Koyama, M. & Murakami, M., 2008, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 645-652 8 p.

研究成果: Conference contribution

Ductile fracture
Electrons
Twinning
Martensitic transformations
Austenite

Infiltration growth processing of bulk mixed REBa 2 Cu 3 O 7-x superconductors: Nano-metal oxides and rare earth elements effects on micro-structural properties

Pavan Kumar Naik, S., Nagaveni, K., Swarup Raju, P. M., Miryala, M., Koblischka, M. R., Koblischka-Veneva, A. D., Oka, T., Iwasa, Y., Ogino, H., Eisaki, H. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540H. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

infiltration
Rare earth elements
Infiltration
Oxides
Superconducting materials
2 引用 (Scopus)

Improvement in the Performance of Bulk MgB2 Material through Optimization of Sintering Process

Kobayashi, H., Miryala, M., Koblischka, M. R., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 73-76 4 p.

研究成果: Conference contribution

sintering
optimization
disks (shapes)
critical current
grain size

Improved superconducting performance of Ag-added nano-diamond doped MgB 2

Dadiel, J. L., Miryala, M. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540I. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

Nanodiamonds
Diamond
Diamonds
diamonds
Chemical analysis

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles
1 引用 (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

Power converters
Thermal cycling
Semiconductor materials
Binary alloys
Fatigue of materials
2 引用 (Scopus)

From Cyano-aromatic Molecules to Nitrogen-doped Carbons by Solution Plasma for the Oxygen Reduction Reaction in Alkaline Medium

Panomsuwan, G., Saito, N. & Ishizaki, T., 2015, Materials Today: Proceedings. 8 版 Elsevier Ltd, 巻 2. p. 4302-4308 7 p.

研究成果: Conference contribution

Nitrogen
Carbon
Oxygen
Plasmas
Molecules

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Metallic compounds
Cracks
Direction compound
Power semiconductor devices
4 引用 (Scopus)

Fine micro-stamping system for micro-pattern printing onto polymers and glasses

Aizawa, T., Itoh, K. & Fukuda, T., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1097-1102 6 p.

研究成果: Conference contribution

Stamping
Printing
Polymers
Glass
Displacement control

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials
1 引用 (Scopus)

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 707-712 6 p.

研究成果: Conference contribution

Soldering alloys
Fatigue of materials
Crack initiation
Grain boundaries
Strain hardening

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper

End corrosion of galvanized steels under atmospheric corrosion environment

Sekita, K., Hirano, T. & Noda, K., 2008, ECS Transactions. 48 版 巻 16. p. 7-13 7 p.

研究成果: Conference contribution

Atmospheric corrosion
Anodic polarization
Corrosion
Steel
Corrosion prevention

Effects of cross-linkage and hydroxyl groups on bonding strength between titanium and segmented polyurethane through 3-(trimethoxysilyl) propyl methacrylate

Sakamoto, H., Hirohashi, Y., Doi, H., Noda, K. & Hanawa, T., 2007, Materials Science Forum. PART 2 版 巻 561-565. p. 1477-1480 4 p. (Materials Science Forum; 巻数 561-565, 番号 PART 2).

研究成果: Conference contribution

Polyurethanes
Titanium
Hydroxyl Radical
Artificial organs
3-(trimethoxysilyl)propyl methacrylate

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Eutectics
Strain rate
Fatigue of materials
Temperature
Ductility
7 引用 (Scopus)

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M. & Tatsumi, K., 2007, Proceedings - Electronic Components and Technology Conference. p. 684-688 5 p. 4249956

研究成果: Conference contribution

Fatigue of materials
Bending tests
Crack propagation
Temperature
Substrates
5 引用 (Scopus)

Effect of MgB4 Addition on the Superconducting Properties of Polycrystalline MgB2

Ishiwata, J., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 69-72 4 p.

研究成果: Conference contribution

critical current
current density
flux pinning
dispersing
leaching
7 引用 (Scopus)

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298

研究成果: Conference contribution

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 713-718 6 p.

研究成果: Conference contribution

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys