研究成果 1983 2019

フィルター
Conference contribution
Conference contribution

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013, ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 6756126

研究成果: Conference contribution

Polyimides
Finite element method

Ar-plasma-modulated optical reset in the SiO2/Cu conductive-bridge resistive memory stack

Kawashima, T., Yew, K. S., Zhou, Y., Ang, D. S., Zhang, H. Z. & Kyuno, K., 2018 1 1, ECS Transactions. Magyari-Kope, B., Bersuker, G., Kobayashi, K., Hacker, C., Park, J. G., Shingubara, S., Saito, Y., Karim, Z., Shima, H., Kubota, H. & Obeng, Y. S. (版). 3 版 Electrochemical Society Inc., 巻 86. p. 55-64 10 p.

研究成果: Conference contribution

Plasmas
Data storage equipment
Oxides
Surface defects
Ions

A study on quenching characteristics of YBaCuO bulk superconductor with deposited Ag layer

Fukuda, K., Fujita, H., Sawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2007, Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts. p. 76-81 6 p. 4318198

研究成果: Conference contribution

Superconducting materials
Quenching
Switches
Energy storage
Contact resistance

Calcium phosphate precipitation by galvanic current between titanium and gold in pseudo-body fluid

Kobayashi, E., Ogo, M., Doi, H., Yoneyama, T., Noda, K. & Hanawa, T., 2007, Materials Science Forum. PART 1 版 巻 539-543. p. 653-656 4 p. (Materials Science Forum; 巻数 539-543, 番号 PART 1).

研究成果: Conference contribution

Body fluids
Calcium phosphate
Titanium
Gold coatings
Gold
8 引用 (Scopus)

Contact resistance characteristics of high temperature superconducting Bulk- III

Imaizumi, T., Yamamoto, N., Tomita, M., Sakai, N., Murakami, M., Hirabayashi, I. & Sawa, K., 2004, Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts. p. 416-420 5 p.

研究成果: Conference contribution

Contact resistance
Switches
Temperature
Metals
High temperature superconductors
8 引用 (Scopus)

Contact resistance characteristics of high temperature superconducting bulk- Part IV

Fujita, H., Imaizumi, T., Tomita, M., Sakai, N., Murakami, M., Hirabayashi, I. & Sawa, K., 2005, Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts. 巻 2005. p. 272-276 5 p. 1518256

研究成果: Conference contribution

Contact resistance
Switches
Metals
Indium
Silver
3 引用 (Scopus)

Contact resistance characteristics of high temperature superconducting bulk - Part V

Fujita, H., Fukuda, K., Sawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2007, Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts. p. 124-130 7 p. 4063111

研究成果: Conference contribution

Contact resistance
Switches
Temperature
Energy storage
Finite element method
1 引用 (Scopus)

Contact resistance characteristics of YBaCuO superconductors with deposited metal layer

Fujita, H., Fukuda, K., Sawa, K., Tomita, M., Murakami, M., Sakai, N. & Hirabayashi, I., 2006, 23rd International Conference on Electrical Contacts, ICEC 2006 - together with the 6th International Session on Electromechanical Devices, IS-EMD 2006. p. 390-395 6 p.

研究成果: Conference contribution

Contact resistance
contact resistance
Superconducting materials
Metals
switches
1 引用 (Scopus)

Corrosion analysis of zinc rich epoxy coatings on steel in NaCl solution

Sofian, A. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2171-2176 6 p.

研究成果: Conference contribution

Steel
Zinc
Paint
Corrosion
Coatings
1 引用 (Scopus)

Corrosion behavior of Al-Al3Ni and Al-Al2Cu functionally graded materials fabricated by a centrifugal method

Noda, K., Miyahara, K. & Watanabe, Y., 2008, AIP Conference Proceedings. 巻 973. p. 574-578 5 p.

研究成果: Conference contribution

intermetallics
corrosion
curves
polarization
borates

Corrosion behavior of type 304 and 316 stainless steels under stress loading environment

Suzuki, K. & Noda, K., 2008, ECS Transactions. 48 版 巻 16. p. 15-21 7 p.

研究成果: Conference contribution

Stainless steel
Corrosion
Passivation
Corrosion resistance
Polarization
6 引用 (Scopus)

Corrosion behavior of zirconium based alloys in simulated body fluids

Tsutsumi, Y., Takano, Y., Doi, H., Noda, K. & Hanawa, T., 2007, Materials Science Forum. PART 2 版 巻 561-565. p. 1489-1492 4 p. (Materials Science Forum; 巻数 561-565, 番号 PART 2).

研究成果: Conference contribution

Body fluids
Pitting
Zirconium
Corrosion
Corrosion resistance

Corrosion performance of zinc-rich paints (ZRP) on mild steel in NaCl solution

Sofian, A. H., Tanaka, A. & Noda, K., 2013, ECS Transactions. 19 版 巻 45. p. 17-24 8 p.

研究成果: Conference contribution

Paint
Carbon steel
Zinc
Corrosion
Coatings
3 引用 (Scopus)

Corrosion resistance and mechanism of zinc rich paint in corrosive media

Sofian, A. H. & Noda, K., 2013, ECS Transactions. 38 版 Electrochemical Society Inc., 巻 58. p. 29-37 9 p.

研究成果: Conference contribution

Paint
Corrosion resistance
Zinc
Electrochemical impedance spectroscopy
Coatings

Corrosion resistance enhancement of 304 stainless steel under droplet of chloride solution by mechanical surface treatment

Widodo, T. D. & Noda, K., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2423-2429 7 p.

研究成果: Conference contribution

Stainless Steel
Surface potential
Corrosion resistance
Surface treatment
Chlorides

Corrosion resistance evaluation of a functionally graded material using an electrochemical sensor

Saitoh, T., Kakefuda, K., Noda, K. & Watanabe, Y., 2008, AIP Conference Proceedings. 巻 973. p. 965-970 6 p.

研究成果: Conference contribution

corrosion resistance
corrosion
evaluation
stainless steels
sensors

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Creep
Nanoparticles
Power semiconductor devices

Degradation of organic coatings on steel investigated by dynamic electrochemical impedance spectroscopy

Itagaki, M., Ono, A., Watanabe, K., Katayama, H. & Noda, K., 2006, ECS Transactions. 9 版 巻 1. p. 215-222 8 p.

研究成果: Conference contribution

Organic coatings
Electrochemical impedance spectroscopy
Degradation
Steel
Corrosion
3 引用 (Scopus)

Degradation of solid polymer membrane in PEFC by hydrogen peroxide

Kato, S., Masahira, Y., Noda, K. & Imai, H., 2008, ECS Transactions. 48 版 巻 16. p. 1-5 5 p.

研究成果: Conference contribution

Hydrogen peroxide
Fuel cells
Electrolytes
Membranes
Degradation
2 引用 (Scopus)

Development of precise micro press forming system for fabrication of micro parts

Yang, M., Aizawa, T., Nakano, S. & Ito, K., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1093-1096 4 p.

研究成果: Conference contribution

Fabrication
Forging
Metal forming
Joining
Metal foil
1 引用 (Scopus)

Dry progressive stamping of copper-alloy snaps by the plasma nitrided punches

Aizawa, T. & Morita, H., 2018 1 1, Technology of Plasticity. Trans Tech Publications Ltd, p. 28-33 6 p. (Materials Science Forum; 巻数 920 MSF).

研究成果: Conference contribution

stamping
punches
copper alloys
Stamping
Copper alloys
6 引用 (Scopus)

Dry transfer stamping by nano-laminated DLC-coated tool

Morita, H., Aizawa, T., Yoshida, N. & Kurozumi, S., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1103-1108 6 p.

研究成果: Conference contribution

Diamond
Stamping
Diamonds
Carbon
Coatings

Duplex coating of AISI 316 and 420 die for hot mold stamping

Aizawa, T., Fukuda, T. & Itoh, K., 2012, Steel Research International. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 1055-1058 4 p.

研究成果: Conference contribution

stamping
Stamping
Nitriding
Oxides
Hardness testing

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 713-718 6 p.

研究成果: Conference contribution

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys
7 引用 (Scopus)

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298

研究成果: Conference contribution

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation
5 引用 (Scopus)

Effect of MgB4 Addition on the Superconducting Properties of Polycrystalline MgB2

Ishiwata, J., Miryala, M., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 69-72 4 p.

研究成果: Conference contribution

critical current
current density
flux pinning
dispersing
leaching
7 引用 (Scopus)

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M. & Tatsumi, K., 2007, Proceedings - Electronic Components and Technology Conference. p. 684-688 5 p. 4249956

研究成果: Conference contribution

Fatigue of materials
Bending tests
Crack propagation
Temperature
Substrates

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Eutectics
Strain rate
Fatigue of materials
Temperature
Ductility

Effects of cross-linkage and hydroxyl groups on bonding strength between titanium and segmented polyurethane through 3-(trimethoxysilyl) propyl methacrylate

Sakamoto, H., Hirohashi, Y., Doi, H., Noda, K. & Hanawa, T., 2007, Materials Science Forum. PART 2 版 巻 561-565. p. 1477-1480 4 p. (Materials Science Forum; 巻数 561-565, 番号 PART 2).

研究成果: Conference contribution

Polyurethanes
Titanium
Hydroxyl Radical
Artificial organs
3-(trimethoxysilyl)propyl methacrylate

End corrosion of galvanized steels under atmospheric corrosion environment

Sekita, K., Hirano, T. & Noda, K., 2008, ECS Transactions. 48 版 巻 16. p. 7-13 7 p.

研究成果: Conference contribution

Atmospheric corrosion
Anodic polarization
Corrosion
Steel
Corrosion prevention

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper
1 引用 (Scopus)

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. 巻 2. p. 707-712 6 p.

研究成果: Conference contribution

Soldering alloys
Fatigue of materials
Crack initiation
Grain boundaries
Strain hardening

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials
4 引用 (Scopus)

Fine micro-stamping system for micro-pattern printing onto polymers and glasses

Aizawa, T., Itoh, K. & Fukuda, T., 2011, Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011. p. 1097-1102 6 p.

研究成果: Conference contribution

Stamping
Printing
Polymers
Glass
Displacement control

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Metallic compounds
Cracks
Direction compound
Power semiconductor devices
2 引用 (Scopus)

From Cyano-aromatic Molecules to Nitrogen-doped Carbons by Solution Plasma for the Oxygen Reduction Reaction in Alkaline Medium

Panomsuwan, G., Saito, N. & Ishizaki, T., 2015, Materials Today: Proceedings. 8 版 Elsevier Ltd, 巻 2. p. 4302-4308 7 p.

研究成果: Conference contribution

Nitrogen
Carbon
Oxygen
Plasmas
Molecules
1 引用 (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

Power converters
Thermal cycling
Semiconductor materials
Binary alloys
Fatigue of materials

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles

Improved superconducting performance of Ag-added nano-diamond doped MgB 2

Dadiel, J. L., Miryala, M. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540I. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

Nanodiamonds
Diamond
Diamonds
diamonds
Chemical analysis
2 引用 (Scopus)

Improvement in the Performance of Bulk MgB2 Material through Optimization of Sintering Process

Kobayashi, H., Miryala, M., Koblischka, M. R., Inoue, K. & Murakami, M., 2015, Physics Procedia. Elsevier, 巻 65. p. 73-76 4 p.

研究成果: Conference contribution

sintering
optimization
disks (shapes)
critical current
grain size

Infiltration growth processing of bulk mixed REBa 2 Cu 3 O 7-x superconductors: Nano-metal oxides and rare earth elements effects on micro-structural properties

Pavan Kumar Naik, S., Nagaveni, K., Swarup Raju, P. M., Miryala, M., Koblischka, M. R., Koblischka-Veneva, A. D., Oka, T., Iwasa, Y., Ogino, H., Eisaki, H. & Murakami, M., 2019 1 1, Superconductivity and Particle Accelerators 2018. Bocian, D. & Romaniuk, R. S. (版). SPIE, 110540H. (Proceedings of SPIE - The International Society for Optical Engineering; 巻数 11054).

研究成果: Conference contribution

infiltration
Rare earth elements
Infiltration
Oxides
Superconducting materials
2 引用 (Scopus)

Influence of al concentration on deformation behavior and fracture mode of fe-30mn-6(SI, AL) alloys

Ogawa, K., Sawaguchi, T., Kikuchi, T., Koyama, M. & Murakami, M., 2008, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 645-652 8 p.

研究成果: Conference contribution

Ductile fracture
Electrons
Twinning
Martensitic transformations
Austenite

International individual internship based on research collaboration on engineering education and academic science

Oka, T., Murakami, M., Sengoku, M., Sato, T., Ogawa, J., Yamagiwa, K., Suzuki, T., Nishimura, S. Y. & Kaneko, F., 2019 1 29, 2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018. Institute of Electrical and Electronics Engineers Inc., 8629681. (2018 World Engineering Education Forum - Global Engineering Deans Council, WEEF-GEDC 2018).

研究成果: Conference contribution

internship
Engineering education
Students
engineering
science
4 引用 (Scopus)

Large area micro-texture imprinting onto metallic sheet via CNC stamping

Aizawa, T., Tamaki, M. & Fukuda, T., 2014, 11th International Conference on Technology of Plasticity, ICTP 2014. Elsevier Ltd, 巻 81. p. 1427-1432 6 p.

研究成果: Conference contribution

Stamping
Aspect ratio
Aluminum sheet
Textures
Motion control

Localized corrosion behavior of austenitic stainless steels under stress loading environment

Noda, K. & Suzuki, K., 2008, ECS Transactions. 52 版 巻 16. p. 239-246 8 p.

研究成果: Conference contribution

Austenitic stainless steel
Corrosion
Stress corrosion cracking
Passivation
Stainless steel

Localized corrosion resistance of Co-Cr alloy in NaCl solution

Suzuki, R., Noda, K., Tsutsumi, Y. & Hanawa, T., 2013, 8th Pacific Rim International Congress on Advanced Materials and Processing 2013, PRICM 8. John Wiley and Sons Inc., 巻 3. p. 2451-2454 4 p.

研究成果: Conference contribution

Corrosion resistance
Stainless Steel
Stainless steel
Polarization
Corrosion

Mapping of phase distribution in electron holography with a stage-scanning system

Lei, D., Mitsuishi, K., Harada, K., Shimojo, M., Ju, D. & Takeguchi, M., 2013, Materials Science Forum. 巻 750. p. 152-155 4 p. (Materials Science Forum; 巻数 750).

研究成果: Conference contribution

Electron holography
Holograms
holography
Electron optics
Scanning
3 引用 (Scopus)

Micro-pattern imprinting onto aluminum thin sheet by CNC-controlled stamping

Aizawa, T. & Fukuda, T., 2012, Steel Research International. Wiley-VCH Verlag, 巻 SPL. ISSUE. p. 739-742 4 p.

研究成果: Conference contribution

stamping
Stamping
Aluminum
Aluminum sheet
grooving

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1.

研究成果: Conference contribution

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation