• 874 引用
  • 15 h指数
1987 …2019

Research output per year

Pureに変更を加えた場合、すぐここに表示されます。

フィンガープリント Kimiyoshi Usamiが有効な場合、研究トピックを掘り下げます。このトピックラベルは、この人物の業績からのものです。これらはともに一意のフィンガープリントを構成します。

ネットワーク 最近の国レベルでの外部協力。点をクリックして詳細を開いてください。

研究成果

A coarse grained-reconfigurable accelerator with energy efficient MTJ-based non-volatile flip-flops

Ikezoe, T., Amano, H., Akaike, J., Usami, K., Kudo, M., Hiraga, K., Shuto, Y. & Yagami, K., 2019 2 13, 2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018. Andrews, D., Feregrino, C., Cumplido, R. & Stroobandt, D. (版). Institute of Electrical and Electronics Engineers Inc., 8641712. (2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018).

研究成果: Conference contribution

  • Approximate Computing Technique Using Memoization and Simplified Multiplication

    Ono, Y. & Usami, K., 2019 6 1, 34th International Technical Conference on Circuits/Systems, Computers and Communications, ITC-CSCC 2019. Institute of Electrical and Electronics Engineers Inc., 8793369. (34th International Technical Conference on Circuits/Systems, Computers and Communications, ITC-CSCC 2019).

    研究成果: Conference contribution

  • Level-Shifter-Less Approach for Multi-VDD SoC Design to Employ Body Bias Control in FD-SOI

    Usami, K., Kogure, S., Yoshida, Y., Magasaki, R. & Amano, H., 2019 1 1, VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Revised and Extended Selected Papers. Monteiro, J., Elfadel, I. A. M., Sonza Reorda, M., Ugurdag, H. F., Maniatakos, M. & Reis, R. (版). Springer New York LLC, p. 1-21 21 p. (IFIP Advances in Information and Communication Technology; 巻数 500).

    研究成果: Conference contribution

  • Single Supply Level Shifter Circuit using body-bias

    Takeyoshi, Y. & Usami, K., 2019 6 1, 34th International Technical Conference on Circuits/Systems, Computers and Communications, ITC-CSCC 2019. Institute of Electrical and Electronics Engineers Inc., 8793384. (34th International Technical Conference on Circuits/Systems, Computers and Communications, ITC-CSCC 2019).

    研究成果: Conference contribution

  • Building block multi-chip systems using inductive coupling through chip interface

    Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H. & Namiki, M., 2018 5 29, Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., p. 152-154 3 p.

    研究成果: Conference contribution