• 413 引用
  • 7 h指数
19962020

Research output per year

Pureに変更を加えた場合、すぐここに表示されます。

フィンガープリント Tadahiro Hasegawaが有効な場合、研究トピックを掘り下げます。このトピックラベルは、この人物の業績からのものです。これらはともに一意のフィンガープリントを構成します。

ネットワーク 最近の国レベルでの外部協力。点をクリックして詳細を開いてください。

研究成果

Toward Distributed Streaming Data Sharing Manager for Autonomous Robot Control

Fukuda, H., Gunji, R., Hasegawa, T., Leger, P. & Figueroa, I., 2020 1, Proceedings of the 2020 IEEE/SICE International Symposium on System Integration, SII 2020. Institute of Electrical and Electronics Engineers Inc., p. 862-866 5 p. 9025920. (Proceedings of the 2020 IEEE/SICE International Symposium on System Integration, SII 2020).

研究成果: Conference contribution

  • Establishment of spraying repair technology for concrete structures using drone

    Iyoda, T., Nimura, K. & Hasegawa, T., 2019 1 1, Life-Cycle Analysis and Assessment in Civil Engineering: Towards an Integrated Vision - Proceedings of the 6th International Symposium on Life-Cycle Civil Engineering, IALCCE 2018. Frangopol, D. M., Caspeele, R. & Taerwe, L. (版). CRC Press/Balkema, p. 2293-2299 7 p. (Life-Cycle Analysis and Assessment in Civil Engineering: Towards an Integrated Vision - Proceedings of the 6th International Symposium on Life-Cycle Civil Engineering, IALCCE 2018).

    研究成果: Conference contribution

  • Flexible Electrostatic Adhesive Device and Feasibility of its Grasping Application

    Mochizuki, K., Hasegawa, T. & Shida, Y., 2019 10, ICCAS 2019 - 2019 19th International Conference on Control, Automation and Systems, Proceedings. IEEE Computer Society, p. 683-685 3 p. 8971655. (International Conference on Control, Automation and Systems; 巻数 2019-October).

    研究成果: Conference contribution

  • Flexible Electrostatic Adhesive Device and its Performance Evaluations

    Takahashi, K., Hasegawa, T. & Yuta, S., 2019 4 25, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., p. 679-682 4 p. 8700457. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

    研究成果: Conference contribution

  • 1 引用 (Scopus)

    Micro ELISA chip to Detect Multiple Allergic Proteins Simultaneously

    Abe, Y., Hasegawa, T. & Yamasita, M., 2019 4 25, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., p. 675-678 4 p. 8700438. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

    研究成果: Conference contribution