Pureに変更を加えた場合、すぐここに表示されます。

Fingerprint Yoshiharu Kariyaが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

Fatigue of materials Engineering & Materials Science
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
fatigue life Physics & Astronomy
Thermal fatigue Engineering & Materials Science
Fatigue crack propagation Engineering & Materials Science
thermal fatigue Physics & Astronomy
crack propagation Physics & Astronomy

ネットワーク 最近の共同研究。丸をクリックして詳細を確認しましょう。

研究成果 1993 2019

  • 1423 引用
  • 20 h指数
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Creep
Nanoparticles
Power semiconductor devices

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper
1 引用 (Scopus)
thermal fatigue
Thermal fatigue
fatigue life
crack propagation
Fatigue crack propagation
crack propagation
Strain energy
Fatigue crack propagation
flux density
evaluation